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PCB Material List

PCB Material List - F4T-1/2 Insulative teflon woven glass fabric copper-clad laminates

PCB Material List

PCB Material List - F4T-1/2 Insulative teflon woven glass fabric copper-clad laminates

F4T-1/2 Insulative teflon woven glass fabric copper-clad laminates

F4T-1/2 is a kind of circuit baseplate based on the insulative teflon PCB, which is compressed with electrolytic copper foil (after oxidation treatment ) on both sides, and then pressed together after high-temperature and high pressure treatment. This product is characterized by excellent electrical performance (i.e. low dielectric constant, low loss) and ideal mechanical strength, which is a good choice for baseplate of Microwave PCB.


F4T-1/2 Technical Specifications

Appearance

Meet the general requirements for baseplate of microwave PCB

Dimensions(mm)

150*150 220*160 250*250 200*300

For special dimensions, customized lamination is available.

Thickness and tolerance

0.5±0.05 1±0.1 1.5±0.15 2±0.2 3±0.3

Plate thickness includes the copper thickness. For special dimensions, customized lamination is available.

Mechanical properties

Angularity

0.02mm/mm for double-layer board

Cutting/ punching property

No burrs after cutting, and the minimum space between two punching holes is 0.55mm.

Peel strength

In normal state:≥18N/cm; In the environment of constant humidity and temperature:≥6 N/cm .

Chemical properties

The chemical etching method for PCB can be used for the circuit processing, the dielectric properties of materials are not changed.

Electrical properties

Names

Test conditions

Unit

Specifications

Gravity

Normal state

g/cm3

2.2~2.3

Water absorption rate

Dip in distilled water of 20±2 degree Celsius for 24 hours.

%

≤0.01

Operating temperature

high-low temperature chamber

degree Celsius

-100~+150

Thermal conductivity coefficient


Kcal /m .h. degree Celsius

0.4

Coefficient of thermal expansion

Temperature rise of 96 degree Celsius per hour

*1

9.8~10*10-5

Shrinkage factor

Two hours in boiling water

%

0.0005

Surface insulation resistance

500V DC

Normal state

M.Ω

≥1*107

Constant humidity and temperature

≥1*105

volume resistance

Normal state

MΩ.cm

≥1*1010

Constant humidity and temperature

≥1*107

Pin resistance

500V DC

Normal state

≥1*105

Constant humidity and temperature

≥1*105

Surface dielectric strength

Normal state

δ=1mm(kV/mm)

≥1.5

Constant humidity and temperature

≥1.4

Permittivity

10GHZ

εr

2. 2.2(±2%)

Dielectric loss angle tangent

10GHZ

tgδ

≤1*10-3