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PCB Material List

PCB Material List - Teflon woven glass fabric copper-clad laminates

PCB Material List

PCB Material List - Teflon woven glass fabric copper-clad laminates

Teflon woven glass fabric copper-clad laminates

Teflon woven glass fabric copper-clad laminates is formulated with varnished glass cloth, prepreg and teflon PCB resin through scientific formulation and strict technology procedures. It takes some advantages over F4B series in electrical performance, including wider range of dielectric constant, low dielectric loss angle tangent, increased resistance and more stable in performance.


Teflon woven glass fabric copper-clad laminates technical specifications

Appearance

Meet the specification requirements for microwave PCB baseplate specified in National and Military Standards.

Types

F4BM220

F4BM255

F4BM265

F4BM300

F4BM350

Permittivity

2.20

2.55

2.65

3.0

3.50

Dimensions(mm)

300*250

350*380

440*550

500*500

460*610

600*500

840*840

840*1200

1500*1000


For special dimensions, customized lamination is available.

Thickness and tolerance(mm)

Plate thickness

0.25

0.5

0.8

1.0


Tolerance

±0.02~±0.04

Plate thickness

1.5

2.0

3.0

4.0

5.0

Tolerance

±0.05~±0.07

Plate thickness includes the copper thickness. For special dimensions, customized lamination is available.

Mechanical properties

Angularity

Plate thickness(mm)

Maximum angularity mm/mm

Original board

Single-sided board

Double-sided board

0.25~0.5

0.03

0.05

0.025

0.8~1.0

0.025

0.03

0.020

1.5~2.0

0.020

0.025

0.015

3.0~5.0

0.015

0.020

0.010

Cutting/ punching property

For the plate of<1mm, no burrs after cutting, minimum space between two punching holes is 0.55mm, no separation.

For the plate of≥1mm, no burrs after cutting, minimum space between two punching holes is 1.10mm, no separation.

Peel strength

In normal state:≥18N/cm; No bubbling, no separation and peel strength ≥15 N/cm when in the environment of constant humidity and temperature and kept in the melting solder of 260 degree Celsius±2 degree Celsius for 20 seconds.

Chemical properties

According to different properties of baseplates, the chemical etching method for PCB can be used for the circuit processing, the dielectric properties of materials are not changed and the holes can be metallized.

Electrical properties

Names

Test conditions

Unit

Specifications

Gravity

Normal state

g/cm3

2.2~2.3

Water absorption rate

Dip in distilled water of 20±2 degree Celsius for 24 hours.

%

≤0.02

Operating temperature

high-low temperature chamber

degree Celsius

-50~+260

Thermal conductivity coefficient


Kcal /m .h. degree Celsius

0.8

Coefficient of thermal expansion

Temperature rise of 96 degree Celsius per hour

Coefficient of thermal expansion*1

≤5*10-5

Shrinkage factor

Two hours in boiling water

%

0.0002

Surface insulation resistance

500V DC

Normal state

M.Ω

≥1*104

Constant humidity and temperature

≥1*103

volume resistance

Normal state

MΩ.cm

≥1*106

Constant humidity and temperature

≥1*105

Pin resistance

500V DC

Normal state

≥1*105

Constant humidity and temperature

≥1*103

Surface dielectric strength

Normal state

δ=1mm(kV/mm)

≥1.2

Constant humidity and temperature

≥1.1

Permittivity

10GHZ

εr

2. 2.20

2. 2.55

2.65(±2%)

2. 3.0

3.5

Dielectric loss angle tangent

10GHZ

tgδ

≤7*10-4


ipcb has produced Teflon woven glass fabric copper-clad laminates products steadily, if you need it, please contact ipcb.