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What is HDI PCB technology?
What is HDI PCB technology?

What is HDI PCB technology?

2019-06-13 22:45:16
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Author:pcb factoty

High density interconnect PCB, or HDI PCB are printed circuit boards with a higher wiring density per unit area than traditional printed circuit boards (PCB). In general, HDI PCBs are defined as PCBs with one or all of the following: microvias; blind vias, buried vias or other microvia technique; built-up laminations and high signal performance considerations. Printed circuit board technology has been evolving with changing technology that calls for smaller and faster products. HDI products are more compact and have smaller vias, pads, and lines and spaces. As a result, HDIs have denser wiring, which means lighter, compact, lower layer count PCBs. Rather than using a few PCBs in a device, one HDI board can house the functionality of the previous boards used.

HDI PCB

HDI PCB (High Density Interconnect PCB) is a relatively high line density of circuit boards using microblind and buried via technology.


HDI PCB is a process that includes inner and outer layers, and then uses holes and metallization in the holes to achieve the function of joining the inner layers of each layer.


With the development of high-density and high-precision electronic products, the requirements for circuit boards are also the same. The most effective way to increase PCB density is to reduce the number of through holes, and accurately set blind and buried holes to meet this requirement, thereby generating HDI boards.


HDI PCB concept

HDI: High-density interconnection technology. It is a multilayer board made of stacking method and micro-blind buried vias.

Micro-hole: In the PCB, the hole with a diameter of less than 6 mils (150μm) is called buried hole: buried in the inner layer of the hole, invisible in the finished product, mainly used for the conduction of the inner line, which can reduce signal interference Probability, and maintain the continuity of the characteristic impedance of the transmission line. Since the buried vias do not occupy the surface area of the PCB, more components can be placed on the surface of the PCB.

Blind hole: connect the surface layer and the inner layer without passing through a complete-through hole.

process

High-density interconnection technology can be divided into

First-order process: 1 + N + 1;

Second-order process: 2 + N + 2;

Third-order process: 3 + N + 3.


HDI PCB has the following advantages:

  1. It can reduce the cost of PCB. When the density of PCB increases to more than eight-layer board, it is manufactured by HDI, and its cost will be lower than that of the traditional and complex pressing process.

  2, increase the line density, the interconnection of traditional circuit boards and parts

  3, is conducive to the use of advanced construction technology

  4. Better electrical performance and signal accuracy

  5, better reliability

  6, can improve thermal properties

  7. It can improve radio frequency interference/electromagnetic wave interference/electrostatic discharge (RFI/EMI/ESD)

   8. Increase design efficiency