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High density specification correlation of FPC board
High density specification correlation of FPC board

High density specification correlation of FPC board

2020-09-11 17:02:13
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Author:pcb factoty

Flexible Printed Circuit Board, also known as "FPC", is a printed circuit made of flexible insulating substrates, and has many advantages that rigid printed circuit boards do not have.


For example, it can be freely bent, wound, and folded, can be arranged arbitrarily according to the space layout requirements, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of FPC flexible boards can greatly reduce the volume of electronic products, and is suitable for the needs of electronic products to develop in the direction of high density, miniaturization and high reliability.


Therefore, FPC flexible boards have been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, PDAs, digital cameras and other fields or products. FPC flexible board also has the advantages of good heat dissipation and solderability, easy assembly and low overall cost, etc. The design of soft and hard combination also makes up for the slight deficiency of the flexible substrate in the component carrying capacity to a certain extent.

 

FPC has single-sided, double-sided and multi-layer boards. The base material used is mainly polyimide copper clad laminate. This material has high heat resistance, good dimensional stability, and a cover film that combines mechanical protection and good electrical insulation properties to form the final product by pressing. The surface and inner conductors of the double-sided, multilayer printed circuit board are metallized to realize the electrical connection of the inner and outer circuits. 


The functions of FPC can be divided into four types, namely Lead Line, Printed Circuit, Onnector and Integration of Function. Its uses cover the range of computers, computer peripheral auxiliary systems, consumer electrical appliances and automobiles.


The increment of PCB in smart phone is mainly reflected in FPC and HDI.

1) At the same time, the demand for high-quality FPC is put forward. In recent years, the use of FPC in smart phones is increasing, which drives the continuous development of the soft board market. Affected by Apple's insistence on using FPC, the number of FPCused in smart phones is around 10-13. In 2017, Apple's new machines used more than 16 FPCs. In the case of increased usage, the more difficult high-end boards account for only 10% - 20%. With the continuous upgrading of the whole machine technology, FPC also leaves room for increment in the unit price of FPC.

Chart source: public data collation

FPC usage of single machine in iphone

FPC usage of single machine in iphone

The innovation of smart phones also increases the demand for high-end materials. For example, the rise of full screen creates rigid demand for COF. COF refers to the process or product that directly encapsulates the chip to FPC. It is the key base material to realize the real full screen of mobile phone. Therefore, the rise of full screen drives the demand of COF and brings price increment.


The products of most FPC enterprises are traditional flexible circuit boards (FPCs), which are mainly composed of three layers of PI plastic film, wiring agent and copper oxide. Many FPCs will fully consider the temperature, so they have estimated a lot in the design scheme, and also pay attention to the oxidation resistance. Other characteristics of FPC flexible circuit board with glue include: the thickness of the board can be reduced, which is consistent with the trend of lightweight development; the residual content of chloride ion after etching is reduced, which reduces the migration of positive ions, and also endangers the long-term credibility of the strips. The high density of the FPC solution after heat treatment is very easy to cause.


Using the "sputter plating / electroplating process", the thin rule 312 copper thickness can be considered in the production process of ipcb flexible circuit board. However, in order to achieve the overall target of FPC production, we must get rid of the investment in machinery and equipment projects and production technology.