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Standard PCB

Halogen-Free PCB

Standard PCB

Halogen-Free PCB

Halogen-Free PCB

Model :  Display Backplane Halogen-Free PCB

Material :  S1150G

Layer :  10Layers

Color : Green/White

Finished Thickness :  0.8mm

Copper Thickness :  0.5OZ

Surface Treatment :  Immersion Gold

Min Trace :  3mil(0.075mm)

Min Space :  3mil(0.075mm)

Characteristic : Halogen-free(HF PCB)

Application : Display Backplane Halogen-Free PCB

Product Details Data Sheet
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC degree Celsius155
TdIPC-TM-650 2.4.24.65% wt. loss degree Celsius355
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/ degree Celsius40
After Tgppm/ degree Celsius230
50-260 degree Celsius%2.8
T260IPC-TM-650 2.4.24.1TMAmin60
T288IPC-TM-650 2.4.24.1TMAmin45
Thermal StressIPC-TM-650 2.4.13.1288 degree Celsius, solder dip-->100S No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm1.15E + 08
E-24/125MΩ.cm4.13E + 08
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance9.61E + 06
E-24/1255.37E + 07
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s178
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV45+kV NB
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91GHz--4.5
IPC-TM-650 2.5.5.9
1MHz--4.8
Dissipation Factor (Df)IPC-TM-650 2.5.5.91GHz--0.011
IPC-TM-650 2.5.5.9
1MHz--0.009
Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm-
After thermal Stress 288 degree Celsius,10sN/mm1.5
125 degree CelsiusN/mm-
Flexural StrengthLWIPC-TM-650 2.4.4AMPa630
CWIPC-TM-650 2.4.4AMPa480
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.10
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

Remarks:

1. Specification sheet: IPC-4101/128, is for your reference only.

2. All the typical value is based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm.

3. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in degree Celsius and the third digit the relative humidity.

Why ban halogen?

Halogen refers to the halogen elements in the periodic table of chemical elements, including fluorine (F), chlorine (CL), bromine (Br), and iodine (1). At present, flame retardant substrates, FR4, CEM-3, etc., flame retardants are mostly brominated epoxy resin. Among the brominated epoxy resins, tetrabromobisphenol A, polymeric polybrominated biphenyls, polymeric polybrominated diphenyl ethers, and polybrominated diphenyl ethers are the main fuel barriers for copper clad laminates. They have low cost and are compatible with epoxy resins. However, studies by related institutions have shown that halogen-containing flame-retardant materials (Polybrominated Biphenyls PBB: Polybrominated Diphenyl Ethyl PBDE) will emit dioxin (dioxin TCDD), benzofuran (Benzfuran), etc. when they are discarded and burned. Large amount of smoke, unpleasant smell, highly toxic gas, carcinogenic, can not be discharged after ingestion, not environmentally friendly, and affect human health. Therefore, the European Union initiated the prohibition of using PBB and PBDE as flame retardants in electronic information products. The Ministry of Information Industry of China also requires that as of July 1, 2006, electronic information products put on the market must not contain substances such as lead, mercury, hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers.


The EU law prohibits the use of six substances including PBB and PBDE. It is understood that PBB and PBDE are basically no longer used in the copper clad laminate industry, and bromine flame retardant materials other than PBB and PBDE, such as tetrabromide, are mostly used. The chemical formula of bisphenol A, dibromophenol, etc. is CISHIZOBr4. This type of copper clad laminate containing bromine as a flame retardant is not regulated by any laws and regulations, but this type of bromine-containing copper clad laminate will release a large amount of toxic gas (brominated type) and emit a large amount of smoke during combustion or electrical fire. ; When the PCB is leveled with hot air and components are welded, the plate is affected by high temperature (>200), and a small amount of hydrogen bromide will be released; whether dioxins will also be produced is still under evaluation. Therefore, FR4 sheets containing tetrabromobisphenol A flame retardant are not currently prohibited by law and can still be used, but they cannot be called halogen-free sheets.


The principle of halogen-free PCB substrate

For now, most of the halogen-free PCB materials are mainly phosphorus-based and phosphorus-nitrogen-based. When phosphorous resin is burned, it is decomposed by heat to generate meta-polyphosphoric acid, which has strong dehydration property, so that a carbonized film is formed on the surface of the polymer resin, which insulates the burning surface of the resin from contact with air, extinguishes the fire, and achieves a flame-retardant effect. The polymer resin containing phosphorus and nitrogen compounds generates incombustible gas when burned, which helps the resin system to be flame-retardant.


Characteristics of halogen-free PCB

1. Insulation of halogen-free PCB material

Due to the use of P or N to replace the halogen atoms, the polarity of the molecular bond segment of the epoxy resin is reduced to a certain extent, thereby improving the quality of the PCB insulation resistance and resistance to breakdown.


2. Water absorption of halogen-free PCB material

The halogen-free sheet material has fewer electrons than halogens in the nitrogen-phosphorus-based oxygen reduction resin. The probability of forming hydrogen bonds with hydrogen atoms in water is lower than that of halogen materials, so the water absorption of the material is lower than Conventional halogen-based PCB flame retardant materials. For PCB boards, low water absorption has a certain impact on improving the reliability and stability of the material.


3. Thermal stability of halogen-free PCB material

The content of nitrogen and phosphorus in the halogen-free PCB board is greater than the halogen content of ordinary halogen-based materials, so its monomer molecular weight and PCB Tg value have increased. In the case of heat, the mobility of its molecules will be lower than that of conventional epoxy resins, so the coefficient of thermal expansion of halogen-free PCB materials is relatively small.

Model :  Display Backplane Halogen-Free PCB

Material :  S1150G

Layer :  10Layers

Color : Green/White

Finished Thickness :  0.8mm

Copper Thickness :  0.5OZ

Surface Treatment :  Immersion Gold

Min Trace :  3mil(0.075mm)

Min Space :  3mil(0.075mm)

Characteristic : Halogen-free(HF PCB)

Application : Display Backplane Halogen-Free PCB


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