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Standard PCB

ATE chip test PCB

Standard PCB

ATE chip test PCB

ATE chip test PCB

Model :  ATE chip test PCB

Material :  isola 370hr

Layer :  12Layers

Color : Green

Board Thickness: 3.0mm

Surface technology: Immersion Gold(5U)

Copper thickness: inner layer 2OZ, outer layer 1OZ

Application : ATE chip test PCB

Product Details Data Sheet

We call the IC test equipment ATE (automatic test equipment), and the PCB used in ATE is called ATE chip test PCB. Generally, a large number of ATE test functions are gathered together, and ate is controlled by computer to test the functionality of semiconductor chips, which includes the combination of software and hardware.


This starts with the process of semiconductor design and manufacturing.

A semiconductor product has to go through three industrial processes: IC design, wafer manufacturing and packaging.


All chip products need two key test nodes:

Chip probing (CP): ate is called probe stage in this stage

Final test (FT for short)

The chip is tested after packaging, and different chip types have different test methods and requirements.

Chip type:

Analog: simulation is a concept that you can talk about slowly. In short, it's the interface to perceive the physical world. In terms of signal characteristics, the analog signal is continuous

Digital chip: the use of digital signals to transmit data information, such as microprocessors. In terms of signal characteristics, it is discrete. As shown in the figure below

Mixed signal chip: naturally, there are two kinds of signals, and various functions are integrated. Like DSP and SOC chips.

Memory / high speed bus chip: the test project of this kind of chip is relatively more complex, and has special test requirements on its own product characteristics.

What is the system for testing a chip?

Tester, DIB / probe card, handler, test software (there are different languages and modules according to different types of machine for engineers to develop)

Wafer Probing

Wafer Probing

The probe is connected to the circuit on the wafer

The probe is connected to the circuit on the wafer

How does the test system work in general?

First of all, the test machine generates a set of signals according to the requirements of the test program, which is generally very simple

The pattern is input into the chip to be tested, and the chip transmits the output value to the ate machine according to the input and its own function. The machine compares the output value with the chip according to the pre programmed test standard.

If it meets the requirements, it will pass; otherwise, it will fail. Of course, there is a tolerance value for the standard, otherwise the failure pile, such a strict pass rate, the design engineer is estimated to be crazy. However, in this difference range, you can continue to do binning tests to grade the products.

Finally, the test program tests our chip by changing different voltage, current and timing, and then debugging and characterization.

Taking memory IC as an example, the test items are generally DC to AC parameter test plus functional test

DC parameter test includes signal pin's open / short, VCC pin's open / short, standby and ICC current and leakage test in operation.

AC parameter test mainly comes from TCAC (column access time) test

For timing test: setup time, hold time, propagation delay and timing calibration

The common application scope of the testing machine is as follows:

Memory IC

ADVANTEST t55xx series

ADVANTEST t53xx series

Nexttest magnum series

Credence Kalos

Verigy V4000 series

Verigy v5000 series

Verigy v93000 HSM series

KingTiger KT2/ KT3

Digital, mixed signal or SOC chip

Teradyne tiger series

Teradyne Flex / Ultra flex series

Teradyne J750 series

Teradyne catalyst series

Credence Sapphire

Credence quarter / duo series

Credence sapphire D series

Credence SC series

Schlumberger exa 2x00 series

Verigy v93000 SOC series

Agilent 94000 series

LTx fusion series

Advantage t77xx series

ADVANTEST T2000 series

ADVANTEST t65xx / t67xx series

LCD Driver

Yokokawa ts67xx series

ADVANTEST t63xx series

Spea C3320

RF chip

Credence asl-3000 series

LTx fusion CX series

Agilent 84000 series

Advatest T7611

Roos Instrument 7100A

Next, let's look at the functional test section

Read Cycle

Wrtie Cycle

Fast Page Mode/ EDO Mode Check

March Column/ March Row

On this basis, special function test items can be added

Checkboard

Butterfly

Diagonais

Moving Inversion

Memory test has its own particularity, but it is the same as other types of ATE chip test in composition. No more than contact / continuity test (open / short), DC parameter test, AC timing test, digital function test and mixed signal test.

Model :  ATE chip test PCB

Material :  isola 370hr

Layer :  12Layers

Color : Green

Board Thickness: 3.0mm

Surface technology: Immersion Gold(5U)

Copper thickness: inner layer 2OZ, outer layer 1OZ

Application : ATE chip test PCB


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