PCB Prototype, High Frequency PCB, IC Substrate, Multilayer PCB and PCB Assembly Manufacturer.
The most reliable PCB custom service factory.
HDI PCB

HDI PCB

HDI PCB

HDI PCB

HDI PCB technics capacity
No.ITEMDescriptionData &    Model
1MaterialBrand SY、ITEQ、KB、NOUYA
2HDI Construction  1+N+1、2+N+2、3+N+3、4+N+4、5+N+5、6+N+6、anylayer
3Construction order N+N、N+X+N、1+(N+X+N)+1
4Layer 1-40Layers
5Min Pattern Width /    SpacingUnit:mil2/2
6Min Mechanical    Hole  Unit:mm0.15mm
7Min Thickness of Core    Board Unit:mil2mil
8Laser Hole Unit:mm0.075mm- 0.1mm
9Min thickness of PPUnit:mil2mil
10Max diameter of resin    plug holeUnit:mm0.4mm
11Electroplating to    fill holes Can do it.
12Electroplating to    fill holes sizeUnit:mil3-5mil
13hole    pile pad/hole pile hole/pad hole(VOP)milCan    do it.
14The    distance from the wall of via hole to the patternmil7mil
15Laser    drilling hole accuracymil0.025mm
16Min    BGA pad center distancemil0.3mm
17Min    SMTmil0.25mm
18Plating    hole-filling sagmil≤10um
19Back    drilled/countersink hole tolerancemil±0.05mm
20Through-hole    plating penetration capacityRate16:1
21Blind    hole plating penetration capacityRate1.2:1
22BGA min PADUnit:mil0.2
23Min Buried    Hole(Mechanical Hole)Unit:mil0.2
24Min Buried Hole(Laser    Hole)Unit:mil0.1
25Min Blind Hole(Laser    Hole)Unit:mil0.1
26Min Blind    Hole(Mechanical Hole)Unit:mil0.2
27Minimum    spacing between laser blind hole and mechanical buried hole Unit:mil0.2
28Min    Laser HoleUnit:mil0.10(depth≤55um)、0.13(depth≤100um)
29MinBGA    pad center distanceUnit:mil0.3
30Interlaminar    alignmentUnit:mil±0.05mm(±0.002")
   The distance from the    wall of via hole to the pattern