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Electronic Design

Electronic Design

Electronic Design

Electronic Design

What rules should be followed in the thermal design of PCB circuit boards?
2021-09-12
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Author:Aure

What rules should be followed in the thermal design of PCB circuit boards?

Electronic equipment must dissipate heat during operation, so thermal design is a problem that must be carefully considered when designing PCB circuit schematics; once the design is improper, it will adversely affect the reliability of electronic equipment. So, what rules should be followed in the thermal design of PCB circuit boards?

1. From the perspective of conducive to heat dissipation, the PCB circuit board is best installed upright, and the distance between the boards should not be less than 2cm.

2. For devices that use free convection air cooling, it is best to arrange the integrated circuits in a vertical manner; for devices that use forced air cooling, it is best to arrange the integrated circuits in a horizontal manner:



What rules should be followed in the thermal design of PCB circuit boards?

3. The components on the same PCB circuit board are arranged as far as possible according to their calorific value and heat dissipation degree: devices with low calorific value or poor heat resistance (such as small signal transistors, etc.) are placed at the top of the cooling air flow; the calorific value is large Or devices with good heat resistance (such as power transistors, etc.) are placed at the most downstream of the cooling airflow.

4. In the horizontal direction, the high-power devices should be placed as close as possible to the edge of the PCB circuit board to shorten the heat transfer path; in the vertical direction, the high-power devices should be placed as close as possible to the top of the PCB circuit board to reduce the temperature of other devices. Influence.

5. Devices that are more sensitive to temperature are best placed in the lowest temperature area (such as the bottom of the device), and multiple devices are best placed in a staggered layout on the horizontal plane.

6. When designing, it is necessary to study the air flow path, reasonably configure the device or printed circuit board; avoid leaving a large airspace in a certain area.

7. A lot of practice shows that the use of reasonable device arrangement can effectively reduce the temperature of the printed circuit.


The above are some rules that should be followed in the thermal design of PCB circuit boards. I hope it will be helpful to all customers and friends. iPcb is a high-tech manufacturing enterprise focusing on the development and production of high-precision PCBs. iPCB is happy to be your business partner. Our business goal is to become the most professional prototyping PCB manufacturer in the world. Mainly focus on microwave high frequency PCB, high frequency mixed pressure, ultra-high multi-layer IC testing, from 1+ to 6+ HDI, Anylayer HDI, IC Substrate, IC test board, rigid flexible PCB, ordinary multi-layer FR4 PCB, etc. Products are widely used in industry 4.0, communications, industrial control, digital, power, computers, automobiles, medical, aerospace, instrumentation, Internet of Things and other fields.