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Electronic Design

Electronic Design

Electronic Design

Electronic Design

What are the common problems in PCB board design?
2021-10-14
View:7
Author:Downs

1. PCB pad overlap

 1. Overlap of pads (except surface pads) means overlap of holes, which will cause drill bit breakage and hole damage due to multiple drilling in one position during the drilling process.

 2. The two holes on the multilayer board overlap. For example, one hole position is an isolation plate, and the other hole position is a connecting plate (flower bed). Therefore, after the backsheet is stretched, it will appear as a separator, leading to scrap.

2. Set the aperture of a single pad

 1. Single-sided pads are usually not drilled. If the drilling needs to be marked, the hole diameter should be designed to be zero. If a value is designed, when the drilling data is generated, the coordinates of the hole will appear at that position, and problems will occur.

 2. Single-sided pads should be specially marked if they are drilled.

Third, the abuse of the graphics layer

 1. Some useless connections have been made on some graphics layers. Initially, the four-layer board was designed to have more than five layers of circuits, which caused misunderstandings.

pcb board

 2. This design requires less trouble. Take Protel software as an example, draw all the lines of each layer with the layer, and mark the lines with the layer. In this way, when the data is polished, the circuit will be cut off because the board layer is not selected, and the connection line will be missed, or the circuit will be short-circuited because the mark line on the board layer is selected. Therefore, the integrity and clarity of the graphics layer will be maintained during the design process.

 3. This violates the traditional design. For example, the surface of the component is designed on the bottom layer and the welding surface is designed on the top layer, causing inconvenience.

Fourth, the random placement of characters

 1. The patch pad of the character cover brings inconvenience to the on-off test of the printed circuit board and the soldering of the components.

 2. The character design is too small, which makes screen printing difficult. If it is too large, the characters will overlap and be difficult to distinguish.

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Sixth, the definition of processing level is not clear

 1. The single board is designed on the top layer. If there is no description on the front and back, the manufactured panel may be equipped with devices instead of soldering.

 2. For example, when designing a four-layer board, the four layers of the top surface 1 and the bottom surface 2 are used, but they are not arranged in this order during the processing, which requires explanation.

Seven, there are too many filling blocks in the design or the filling blocks have very thin filling lines

 1. There is a phenomenon that the generated photo data is lost and the photo data is incomplete.

 2. Since the filling blocks are drawn line by line in the light drawing data processing process, the amount of light drawing data generated is quite large, which increases the difficulty of data processing.

Eight, drawing board with filling blocks

 The drawing board with filler blocks can pass the Democratic Republic of Congo inspection when designing the circuit, but it is not suitable for processing. Therefore, it is not possible to directly generate solder mask data for such pads. When the solder resist is applied, the area of the filler block will be covered by the solder resist, making it difficult to solder the components

Nine, the surface mount device pad is too short

 This is for switch testing. For too dense surface mount devices, the distance between the two legs is very small, and the pads are very thin. In order to install the test pins, a staggered position up and down (left and right) must be used. For example, if the pad design is too short, it will not affect component mounting, but it will prevent the test pins from opening properly.

Ten, large area grid spacing is too small

 The edges between the same lines constituting the large-area grid lines are too small (less than 0.3 mm). In the manufacturing process of printed circuit boards, many damaged films are easily attached to the circuit board after the image is displayed, causing wire breakage.

11. The electrical layer is the flower pad and connection

Because the power supply is designed with a flower cushion pattern, the ground layer is opposite to the image on the actual printed board, and all connection lines are isolated lines, which should be very clear to the PCB designer. By the way, when drawing isolation lines for several groups of power supplies or several types of grounding, care should be taken to avoid leaving gaps, shorting the two groups of power supplies or blocking the connection area (separate one group of power supplies).