PCB sans halogène

Remarks:

1. Fiche technique: IPC - 4101/128, is for your reference only.

2. All the typical value is based on the 1.Échantillon de 6 mm, while the Tg is for specimen≥0.50mm.

3. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Société anonyme. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

Why ban halogen?

Les halogènes sont des éléments halogènes dans le tableau périodique des éléments chimiques., including fluorine (F), chlorine (CL), bromine (Br), and iodine (1). At present, flame retardant substrates, FR4, CEM - 3, Attendez.., Les retardateurs de flamme sont principalement des résines époxy bromées. Among the brominated epoxy resins, tetrabromobisphenol A, polymeric polybrominated biphenyls, polymeric polybrominated diphenyl ethers, and polybrominated diphenyl ethers are the main fuel barriers for copper clad laminates. They have low cost and are compatible with epoxy resins. However, studies by related institutions have shown that halogen-containing flame-retardant materials (Polybrominated Biphenyls PBB: Polybrominated Diphenyl Ethyl PBDE) will emit dioxin (dioxin TCDD), benzofuran (Benzfuran), etc. when they are discarded and burned. Large amount of smoke, unpleasant smell, highly toxic gas, carcinogenic, can not be discharged after ingestion, not environmentally friendly, and affect human health. Therefore, L'UE a commencé à interdire l'utilisation des PBB et des PBDE comme retardateurs de flamme dans les produits d'information électroniques. Le Ministère chinois de l'industrie de l'information a également demandé qu'à compter du 1er juillet, 2006, electronic information products put on the market must not contain substances such as lead, mercury, Chrome hexavalent, polybrominated biphenyls or polybrominated diphenyl ethers.

The EU law prohibits the use of six substances including PBB and PBDE. It is understood that PBB and PBDE are basically no longer used in the copper clad laminate industry, and bromine flame retardant materials other than PBB and PBDE, such as tetrabromide, are mostly used. The chemical formula of bisphenol A, dibromophenol, etc. is CISHIZOBr4. This type of copper clad laminate containing bromine as a flame retardant is not regulated by any laws and regulations, but this type of bromine-containing copper clad laminate will release a large amount of toxic gas (brominated type) and emit a large amount of smoke during combustion or electrical fire. B) la question; Lors du nivellement des PCB à l'air chaud et du soudage des composants, the plate is affected by high temperature (>200), De faibles quantités de bromure d'hydrogène seront libérées; La question de savoir si des dioxines peuvent également être produites est toujours à l'étude.. Therefore, FR4 sheets containing tetrabromobisphenol A flame retardant are not currently prohibited by law and can still be used, but they cannot be called halogen-free sheets.

The principle of halogen-free PCB substrate

For now, La plupart des PCB sans halogène sont principalement des groupes phosphorés et phosphorazotés. When phosphorous resin is burned, it is decomposed by heat to generate meta-polyphosphoric acid, Forte déshydratation, so that a carbonized film is formed on the surface of the polymer resin, Isoler la surface de combustion de la résine de l'air, extinguishes the fire, Et obtenir un effet ignifuge. The polymer resin containing phosphorus and nitrogen compounds generates incombustible gas when burned, Cela aide à rendre le système de résine ignifuge.

Characteristics of halogen-free PCB

1. Insulation of halogen-free PCB material

Due to the use of P or N to replace the halogen atoms, La polarité de la liaison moléculaire de la résine époxy diminue dans une certaine mesure, thereby improving the quality of the PCB insulation resistance and resistance to breakdown.

2. Water absorption of halogen-free PCB material

The halogen-free sheet material has fewer electrons than halogens in the nitrogen-phosphorus-based oxygen reduction resin. La probabilité de former une liaison hydrogène avec un atome d'hydrogène dans l'eau est inférieure à celle d'un matériau halogène, so the water absorption of the material is lower than Conventional halogen-based PCB flame retardant materials. Pour PCB board, low water absorption has a certain impact on improving the reliability and stability of the material.

3. Thermal stability of halogen-free PCB material

The content of nitrogen and phosphorus in the halogen-free PCB board is greater than the halogen content of ordinary halogen-based materials, Par conséquent, le poids moléculaire du monomère et la valeur TG des PCB ont augmenté.. In the case of heat, Sa mobilité moléculaire sera inférieure à celle de la résine époxy conventionnelle, so the coefficient of thermal expansion of halogen-free PCB materials is relatively small.