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Technique RF
Sélection et production de PCB à haute fréquence
Technique RF
Sélection et production de PCB à haute fréquence

Sélection et production de PCB à haute fréquence

2021-08-23
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Author:Kyra

The definition of circuit board production high frequency board
PCB High Frequency Board refers to a special circuit board with a higher electromagnetic frequency, which is used for high frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meter). It is a microwave substrate The copper clad board is a circuit board produced by using part of the process of the ordinary rigid circuit board manufacturing method or using a special processing method. Generally speaking, Une carte HF peut être définie comme une carte de circuit dont la fréquence est supérieure à 1 GHz!

PCB High Frequency Board

Avec le développement rapide de la science et de la technologie, de plus en plus d'équipements sont conçus pour être utilisés dans la bande de fréquences micro - ondes (> 1 GHz) et même dans le domaine des ondes millimétriques (30 GHz). Cela signifie également des fréquences plus élevées et des exigences plus élevées en matière de matériaux pour les circuits imprimés. Par exemple, le matériau du substrat a besoin d'excellentes propriétés électriques, d'une bonne stabilité chimique, et avec l'augmentation de la fréquence du signal de puissance, la perte sur le substrat est très faible, de sorte que l'importance du panneau à haute fréquence est soulignée. 2. PCB High Frequency Board application field: Mobile Communication products; Amplificateurs de puissance, amplificateurs à faible bruit, Attendez..; Les éléments passifs tels que les distributeurs de puissance, les coupleurs, les duplex, les filtres, Attendez..; Dans le domaine du système anti collision automobile, du système satellite, du système radio et d'autres domaines, l'électronique à haute fréquence est la tendance au développement.

PCB High Frequency Board

PCB high frequency board application field mobile communication products; power amplifiers, Amplificateur à faible bruit, Attendez..; passive components such as power splitters, Coupleur, duplexers, Filtre, etc.B) la question; Système anti collision automobile, Systèmes satellitaires, radio systems Et autres domaines, electronics High-frequency equipment is a development trend.

Classification of high frequency board powder ceramic filled thermosetting material
A. Manufacturer:
4350B/4003C from Rogers
Arlon's 25N/25FR
Taconic's TLG series
B. Processing method:
The processing process is similar to epoxy resin/glass woven cloth (FR4), except that the sheet is relatively brittle and easy to break. Pendant le forage et le Gong, the life of the drill tip and gong knife is reduced by 20%. PTFE (polytetrafluoroethylene) material
A. Manufacturer: RO3000 series, Série RT, TMM series from Rogers
Arlon's AD/Série AR, IsoClad series, CuClad series
Taconic's RF series, TLX series, TLY series
Taixing Microwave's F4B, F4bm, F4BK, TP-2
B. Processing method: 1. Cutting: The protective film must be kept for cutting to prevent scratches and creasing
2. Drilling
1. Use a brand new drill tip (standard 130), one by one is the best, the pressure of the presser foot is 40psi
2. The aluminum sheet is the cover plate, and then the PTFE plate is tightened with a 1mm melamine backing plate
3. After drilling, use an air gun to blow out the dust in the hole
4. Use the most stable drilling rig and drilling parameters (basically the smaller the hole, Plus le forage est rapide, Plus la charge de la puce est faible, the smaller the return speed)
3. Hole treatment
Plasma treatment or sodium naphthalene activation treatment is conducive to hole metallization
4.PTH copper sink
1 After the micro-etching (the micro-etching rate has been controlled by 20 microinches), the PTH pulls from the de-oiler cylinder to enter the board
2 If necessary, Par le deuxième PTH, just start the board from the expected cylinder
5. Solder mask
1 Pre-treatment: Use acidic plate washing instead of mechanical grinding plate
2 Baking plate after pretreatment (90 degree Celsius, 30min), brush with green oil to cure
3 Baking plates in three stages: one section of 80 degree Celsius, 100 °C, 150 °C, each for 30 minutes (if you find that the substrate surface is oily, you can rework: wash off the green oil and reactivate it)
6.Gong board
Lay the white paper on the circuit surface of the Tôle PTFE, and clamp it up and down with the FR-4 substrate board or phenolic base plate with a thickness of 1.0MM etched to remove the copper, as shown in the figure: high-frequency board lamination method
The burrs on the back of the gong board need to be carefully trimmed by hand to prevent damage to the substrate and copper surface, and then separated by a considerable size of sulfur-free paper, Inspection de l'apparence. To reduce burrs, La clé est que le processus Gong - Board doit avoir un bon effet.

Process flow NPTH's PTFE sheet processing flow
Cutting-Drilling-Dry Film-Inspection-Etching-Erosion Inspection-Solder Mask-Characters-Spray Tin-Forming-Testing-Final Inspection-Packaging-Shipment
PTH's PTFE plate processing flow
Cutting-drilling-hole treatment (plasma treatment or sodium naphthalene activation treatment)-copper immersion-board electricity-dry film-inspection-diagram electricity-etching-corrosion inspection-solder mask-character-spray tin-molding-test-final Inspection-Packaging-Shipping