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Différence entre la longueur totale de la carte de circuit et du film
L'actualité PCB
Différence entre la longueur totale de la carte de circuit et du film

Différence entre la longueur totale de la carte de circuit et du film

2021-08-22
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Author:Aure

Différence sur toute la longueur Circuits imprimés and the film

Carte de circuit longue / super longue Films: techniques de traitement dont les gens parlent souvent, and the applied potion is acid-alkali etching process film is due to the route or route required after the film photo is made. La surface en cuivre est parfaitement transparente, and the unacceptable part is gray-black. Après exposition au processus de routage, the fully transparent part is oxidized and hardened due to the wet film resist being irradiated by the sun, Et la prochaine solution de développement - - la technologie de traitement - - rincera le film humide sans fond dur. Therefore, the Plaque super longue Circuits imprimés only bites the wet film and washes away a part of the copper (the gray-black part of the film photo) during the etching process, Et conserver le film humide. Not washed away belongs to the route we want (a part of the film photo that is completely transparent)
The whole piece of Plaque super longue Circuits imprimés: la technique de traitement pattri dont on parle souvent, and the potion used is the alkaline etching process. Une partie du contenu est entièrement transparente. Après exposition par le même processus de traitement des trajets, the fully transparent part is hardened due to the oxidation of the wet film resist by the sun. La prochaine génération de technologies de traitement des développeurs rendra le film humide plus difficile à laver, Deuxièmement, le procédé de placage étain - plomb. The tin-lead is plated on the copper surface washed away by the wet film in the previous processing process (developing solution), and then the film is removed (removing the hard bottom due to sunlight) Wet film), Lors de la prochaine gravure, use alkaline xian water to cut off the copper pool that is not maintained by tin and lead (the part of the film photo is fully transparent), and the rest is the route we want (the film photo is gray and black Part of)


The difference between the full length of the Circuits imprimés and the film

The whole film and the film are actually selected according to the processing technology of each long board/ultra-long board Circuits imprimés Usine. The whole film: the processing technology is (Carte de circuit recto - verso) cutting-punching-CCP (one-time electroplating process) Also called thickened copper)-route-two copper (pattern electroplating process) followed by SES line (removal film-etching process-stripping tin) film: the processing technology is (double-sided Circuits imprimés / Plaque super longue Circuits imprimés) Cutting-punching-CCP (one-time electroplating process is also called thickened copper)-route (not through two copper pattern electroplating process) followed by DES line (etching process-film removal)