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Microwave Tech
Multi-layer printed circuit board testing of PCB circuit board processing manufacturers
Microwave Tech
Multi-layer printed circuit board testing of PCB circuit board processing manufacturers

Multi-layer printed circuit board testing of PCB circuit board processing manufacturers

2021-10-26
View:191
Author:Belle
  1. ipcb has a professional circuit board production team and domestic leading automated production equipment. PCB products include 1-32 layer boards, high TG boards, thick copper boards, rigid-flex boards, high-frequency boards, and mixed dielectric laminates. , Blind and buried via boards, metal substrates and halogen-free boards.


Finished multi-layer PCB circuit board inspection is a very important part of the production process. Finished product inspection mainly checks whether the finished multi-layer PCB circuit board has open circuit or short circuit or line over-corrosion. In most PCB circuit board manufacturers in China, Multilayer circuit board finished product testing generally needs to go through the following process: first, determine the test point set on the board according to a certain test requirement; secondly, process the test needle bed according to the test point set and drilling information (a needle bed test machine).


 According to the test point diagram and netlist, assemble or connect (for matrix combination test) to test the needle bed; perform electrical tests such as short circuit and open circuit on the PCB circuit board. Among them, the generation of test point sets is the key link, especially for multi-layer PCB circuit board. Previously, for single-sided, double-sided, and multi-layer boards using through-hole technology, the test point set generation has always been completed manually. For those boards with few pads and sparse facets, it can still meet the requirements, but with With the progress of microelectronics technology, the layout density of components is getting higher and higher, and the routing is more and more complicated. Moreover, the life cycle of products is getting shorter and shorter. There are more tasks in small batches and multiple varieties, and time requirements are tight. Determining the unfair test point set is inefficient and error-prone, so it can no longer meet the competitive needs of fast and high-quality production


PCB circuit board

2. With the development of the electronics industry, the integration of electronic components is getting higher and higher, and the volume is getting smaller and smaller, and BGA type packaging is generally used. Therefore, the circuits of multi-layer pcb will become smaller and smaller, and the number of layers will increase. To reduce the line width and line spacing is to use the limited area as much as possible, and to increase the number of layers is to use space. The main line of the future circuit board will be 2-3mil, or smaller.


Dingji has a professional circuit board production team, with more than 110 senior engineers and professional managers with more than 15 years of work experience; it has domestic leading automatic production equipment, PCB products include 1-32 layer boards, high TG boards, thick Copper board, rigid-flex board, high frequency board, mixed dielectric laminate, blind buried via board, metal substrate and halogen-free board.


Via is one of the important components of multilayer PCB. The cost of drilling usually accounts for 30% to 40% of the cost of multilayer PCB manufacturing. Simply put, every hole on the PCB can be called a via.


From the point of view of function, vias can be divided into two categories: one is used for electrical connection between layers; the other is used for fixing or positioning devices. In terms of process, these vias are generally divided into three categories, namely blind vias, buried vias and through vias. Blind vias are located on the top and bottom surfaces of the printed circuit board and have a certain depth. They are used to connect the surface line and the underlying inner line. The depth of the hole usually does not exceed a certain ratio (aperture). Buried hole refers to the connection hole located in the inner layer of the printed circuit board, which does not extend to the surface of the circuit board.


Fast samples of high-precision circuit boards, 6-7 days for bulk orders for single and double panels, 9-12 days for 4-8 layers, 15-20 days for 10-16 layers, and 20 days for HDI boards. Double-sided proofing can be delivered in as fast as 8 hours.