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IC Substrate

Flexible IC packaging substrate multifunctional appearance microscopic imaging intelligent detector
2021-08-23
View:103
Author:Belle

Research on Control Strategy of Electric Vehicle Power System Based on Energy Utilization
Project introduction
        Aiming at the problem of low energy utilization that restricts the performance of electric vehicles and the popularization and application of electric vehicles, with the goal of increasing its energy consumption per unit mileage, a control strategy for electric vehicle power systems based on electric energy utilization is proposed. This strategy uses the optimization design of the speed curve of the electric vehicle acceleration process based on the energy utilization rate and the torque control technology of the electric vehicle power system to reduce the energy consumption per unit mileage of the electric vehicle under NEDC operating conditions by 551.634 compared with the linear control strategy. J/km. The control strategy of electric vehicle power system based on energy utilization rate is mainly used in the field of energy-saving control of pure electric vehicle power system, and it has a larger market and application prospects.
Different acceleration curve acceleration experiment of pure electric vehicle

Flexible IC packaging substrate

 
Flexible IC packaging substrate multifunctional appearance microscopic imaging intelligent detector
Project introduction
         High-density flexible printed circuits, especially flexible IC packaging substrates and flexible circuit boards, are widely used in advanced IC packaging, mobile phones, PDAs, telecommunications and other civil and aerospace portable electronic information products. The localization of high-density flexible printed circuits is a major national issue. One of the main tasks in the field of special science and technology 02 special packaging and testing is of great strategic significance for enhancing China's scientific and technological strength, breaking the monopoly of the international market, and ensuring the safety of China's electronic information industry. This product applies high-speed precision visual inspection technology of metallographic microscope and dual CCD flexible combined imaging, breaking through the manufacturing process of drilling, pattern transfer, etching, printing and the line width, line spacing, aperture, oxidation, foreign matter, and gold of the finished product. Fingers and other high-speed precision defect detection and analysis problems have formed a fully automatic intelligent defect detection and analysis instrument for key processes and finished products such as drilling, pattern transfer, etching, and printing. This product includes automatic loading and unloading conveying mechanism, XYZ control system, microscopic imaging and industrial CCD imaging system, appearance inspection software system, which can realize drilling, etching, developing and automatic production process of flexible IC packaging substrate or printed circuit Intelligent identification and diagnosis of defects in the appearance of finished products and other processes, judging whether there are defects in the appearance and analyzing the mechanism of the defects; the detector combines precision microscopic imaging and general industrial imaging technology, and can be based on the line width and line spacing accuracy requirements of the printed circuit The automatic switching of the image acquisition system is a complex optical-mechanical-mechanical integrated precision packaging equipment, and the main technical performance indicators have reached the leading domestic level.
           It is applied to the ultra-precision detection of defects in the production process of flexible integrated circuit packaging substrates and flexible circuit boards and the quality of finished products, and promotes Guangzhou to become the world's leading advanced flexible integrated circuit packaging industry base. It can also be applied to 3D printing, 3D packaging, etc. The quality analysis and inspection process has very broad application prospects.

Flexible IC packaging substrate