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IC Substrate

IC Substrate - What are IC chips? What are the types of IC chips?

IC Substrate

IC Substrate - What are IC chips? What are the types of IC chips?

What are IC chips? What are the types of IC chips?

2021-09-17
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Author:Belle

Abstract: IC chip (Integrated Circuit) is an integrated circuit formed by a large number of microelectronic components (transistors, resistors, capacitors, diodes, etc.) on a plastic base to make a chip. Almost all the chips seen at present can be called IC chips. Below, the editor will introduce you to the relevant knowledge of IC chips.


【The role of IC chips】What are IC chips? What are the types of IC chips?

What is an IC chip

IC chip (Integrated Circuit) is an integrated circuit formed by a large number of microelectronic components (transistors, resistors, capacitors, diodes, etc.) on a plastic base to make a chip. Almost all the chips seen at present can be called IC chips.

"Integrated circuit" is a kind of miniature electronic device or component. A certain process is used to interconnect the transistors, diodes, resistors, capacitors, and inductors and other components and wiring required in a circuit, fabricate them on a small or several small semiconductor wafers or dielectric substrates, and then encapsulate them in a tube Inside the shell, it becomes a miniature structure with the required circuit functions; all of the components have been structured as a whole, making the electronic components a big step towards miniaturization, low power consumption and high reliability. It is represented by the letter "IC" in the circuit. The inventors of integrated circuits are Jack Kilby (silicon-based integrated circuits) and Robert Noyth (germanium-based integrated circuits). Most applications in the semiconductor industry today are silicon-based integrated circuits.

Now the industry will call integrated circuits ic chips.

What types of IC chips are there?

(1) Classified by functional structure


Integrated circuits can be divided into two categories: analog integrated circuits and digital integrated circuits according to their functions and structures.

Analog integrated circuits are used to generate, amplify and process various analog signals (referring to signals whose amplitude changes with time boundaries. For example, audio signals of semiconductor radios, tape signals of VCRs, etc.), while digital integrated circuits are used to generate, amplify and process Various digital signals (referring to signals with discrete values in time and amplitude. For example, audio signals and video signals reproduced by VCD and DVD).


The basic analog integrated circuits include operational amplifiers, multipliers, integrated voltage regulators, timers, signal generators, etc. There are many types of digital integrated circuits. Small-scale integrated circuits have a variety of gates, such as NAND gates, NOT gates, and OR gates. Medium-scale integrated circuits have data selectors, codecs, flip-flops, counters, and registers. Large-scale or very large-scale integrated circuits include PLD (Programmable Logic Device) and ASIC (Application Specific Integrated Circuit).


From the perspective of PLD and ASIC, the distinction between components, devices, circuits, and systems is no longer very strict. Not only that, the PLD device itself is just a hardware carrier, and different circuit functions can be realized by loading different programs. Therefore, modern devices are no longer pure hardware. Software devices and corresponding software electronics have been widely used in modern electronic design, and their status is becoming more and more important. There are many types of circuit components. With the continuous improvement of electronic technology and technology, a large number of new devices continue to appear. The same device also has multiple packaging forms. For example, SMD components have been seen everywhere in modern electronic products. For different use environments, the same device has different industrial standards. Domestic components usually have three standards, namely: civil standards, industrial standards, and military standards. Different standards have different prices. The price of military standard devices may be ten times or more than civilian standards. Industry standards are somewhere in between.


(2) Classified by production process

Integrated circuits can be divided into semiconductor integrated circuits and thin film integrated circuits according to the manufacturing process.

film integrated circuits are classified into thick film integrated circuits and thin film integrated circuits.

(3) Classified by level of integration


Integrated circuits are divided into small-scale integrated circuits (SSI), medium-scale integrated circuits (MSI), large-scale integrated circuits (LSI), very large-scale integrated circuits (VLSI), and ultra-large-scale integrated circuits (ULSI) according to their scale.

(4) According to the different types of conductivity


Integrated circuits can be divided into bipolar integrated circuits and unipolar integrated circuits according to their conductivity types.

The manufacturing process of bipolar integrated circuits is complicated, and the power consumption is relatively large, which means that the integrated circuits are of TTL, ECL, HTL, LST-TL, STTL and other types. Unipolar integrated circuits have simple manufacturing processes, low power consumption, and are easy to make large-scale integrated circuits. Representative integrated circuits include CMOS, NMOS, PMOS, and other types.


(5) Classified by purpose

Integrated circuit According to the purpose, it can be divided into integrated circuit for TV. Integrated circuits for audio, integrated circuits for video disc players, integrated circuits for video recorders, integrated circuits for computers (microcomputers), integrated circuits for electronic organs, integrated circuits for communications, integrated circuits for cameras, integrated circuits for remote control, integrated circuits for language, integrated circuits for alarms Circuits and various application-specific integrated circuits.

TV integrated circuits include line and field scanning integrated circuits, intermediate amplifier integrated circuits, sound integrated circuits, color decoding integrated circuits, AV/TV conversion integrated circuits, switching power Chinese picture processing integrated circuits, microprocessor (CPU) integrated circuits, memory integrated circuits, etc.


Audio integrated circuits include AM/FM high-intermediate frequency circuits, stereo decoding circuits, audio preamplifier circuits, audio operational amplifier integrated circuits, audio power amplifier integrated circuits, surround sound processing integrated circuits, level drive integrated circuits, and electronic volume control integrated circuits Circuits, delay reverberation integrated circuits, electronic switch integrated circuits, etc.

Integrated circuits for DVD players include system control integrated circuits, video encoding integrated circuits, MPEG decoding integrated circuits, audio signal processing integrated circuits, sound effect integrated circuits, RF signal processing integrated circuits, digital signal processing integrated circuits, servo integrated circuits, and motor drives Integrated circuits, etc.


Integrated circuits for video recorders There are system control integrated circuits, servo integrated circuits, drive integrated circuits, audio processing integrated circuits, and video processing integrated circuits.


1, BGA (ball grid array)

Spherical contact display, one of surface mount packages. On the back of the printed circuit board, spherical bumps are produced in the display method to replace the pins, and the LSI chip is assembled on the front side of the printed circuit board, and then sealed by molding resin or potting. Also known as bump display carrier (PAC). Pins can exceed 200, which is a package for multi-pin LSI. The package body can also be made smaller than QFP (Quad Flat Package). For example, a 360-pin BGA with a pin center distance of 1.5mm is only 31mm square; while a 304-pin QFP with a pin center distance of 0.5mm is 40mm square. And BGA does not have to worry about pin deformation like QFP. This package was developed by Motorola Corporation of the United States. It was first adopted in portable phones and other devices, and may be popularized in personal computers in the United States in the future. Initially, the BGA pin (bump) center distance was 1.5mm, and the number of pins was 225. There are also some LSI manufacturers that are developing 500-pin BGAs. The problem with BGA is the visual inspection after reflow soldering. It is not yet clear whether an effective visual inspection method is available. Some believe that due to the large welding center distance, the connection can be regarded as stable and can only be processed through functional inspection. The American Motorola company calls the package sealed with molded resin OMPAC, and the package sealed by the potting method is called GPAC (see OMPAC and GPAC).


2, BQFP(quad flat package with bumper)

Four-side pin flat package with cushion. In one of the QFP packages, protrusions (buffer pads) are provided at the four corners of the package body to prevent bending and deformation of the pins during transportation. American semiconductor manufacturers mainly use this package in circuits such as microprocessors and ASICs. The pin center distance is 0.635mm, and the pin number is about 84 to 196 (see QFP).


3, butt joint PGA (butt joint pin grid array)

Another name for surface mount PGA (see surface mount PGA).

4, C-(ceramic)

represents the mark of ceramic package. For example, CDIP stands for ceramic DIP. It is a mark that is often used in practice.

5, Cerdip


Ceramic dual-in-line package sealed with glass, used in ECL RAM, DSP (digital signal processor) and other circuits. Cerdip with glass window is used for ultraviolet erasable EPROM and microcomputer circuit with EPROM inside. The pin center distance is 2.54mm, and the number of pins ranges from 8 to 42. In Japan, this package is denoted as DIP-G (G means glass seal).


6, Cerquad

One of the surface mount packages, that is, the use of a sealed ceramic QFP, which is used to package logic LSI circuits such as DSP. Cerquad with windows is used to encapsulate EPROM circuits. The heat dissipation is better than plastic QFP, and it can tolerate 1.5~2W power under natural air cooling conditions. But the packaging cost is 3 to 5 times higher than that of plastic QFP. The center distance between pins has a variety of specifications such as 1.27mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm and so on. The number of pins ranges from 32 to 368.


7, CLCC (ceramic leaded chip carrier)

Ceramic chip carrier with pins, one of the surface mount packages, the pins are led out from the four sides of the package in a T-shape. It is used to encapsulate the ultraviolet erasable EPROM and the microcomputer circuit with EPROM with windows. This package is also called QFJ, QFJ-G (see QFJ).


8, COB (chip on board)

Chip-on-board packaging is one of the bare chip mounting technologies. The semiconductor chip is hand-attached and mounted on the printed circuit board. The electrical connection between the chip and the substrate is realized by wire stitching, and the electrical connection between the chip and the substrate is realized by wire stitching. Resin covered to ensure reliability. Although COB is the simplest bare chip mounting technology, its packaging density is far inferior to TAB and flip-chip bonding technology.

9, DFP (dual flat package)


Two-sided pin flat package. It is another name for SOP (see SOP). There used to be this term, but it is basically not used now.

10, DIC (dual in-line ceramic package)

Another name for ceramic DIP (including glass seal) (see DIP).

11, DIL(dual in-line)

Another name for DIP (see DIP). European semiconductor manufacturers often use this name.


12, DIP (dual in-line package)

Dual in-line package. One of the plug-in packages, the pins are drawn from both sides of the package, and the package materials are plastic and ceramic. DIP is the most popular plug-in package, and its application range includes standard logic ICs, memory LSIs, and microcomputer circuits. The pin center distance is 2.54mm, and the number of pins is from 6 to 64. The package width is usually 15.2mm. Some packages with a width of 7.52mm and 10.16mm are called skinny DIP and slim DIP (narrow DIP) respectively. But in most cases, no distinction is made, and they are simply collectively referred to as DIP. In addition, ceramic DIP sealed with low-melting glass is also called cerdip (see cerdip).

13, DSO (dual small out-lint)

Two-sided pin small outline package. Another name for SOP (see SOP). Some semiconductor manufacturers use this name.


14, DICP (dual tape carrier package)

Two-sided lead-carrying package. One of TCP (Tape Carrier Package). The pins are made on the insulating tape and lead out from both sides of the package. Due to the use of TAB (Automatic On-Load Soldering) technology, the package outline is very thin. It is often used in LCD driver LSI, but most of them are custom products. In addition, the 0.5mm thick memory LSI book package is in the development stage. In Japan, DICP is named DTP in accordance with EIAJ (Electronic and Mechanical Industries of Japan) Association standards.


15, DIP (dual tape carrier package)

Same as above. The Japanese Electronic Machinery Industry Association standard names DTCP (see DTCP).

16, FP (flat package)

Flat package. One of surface mount packages. Another name for QFP or SOP (see QFP and SOP). Some semiconductor manufacturers use this name.

17, flip-chip


flip-soldering the chip. One of the bare chip packaging technologies is to make metal bumps in the electrode area of the LSI chip, and then connect the metal bumps with the electrode area on the printed circuit board. The footprint of the package is basically the same as the chip size. It is the smallest and thinnest of all packaging technologies. However, if the thermal expansion coefficient of the substrate is different from that of the LSI chip, a reaction will occur at the joint, which will affect the reliability of the connection. Therefore, it is necessary to use resin to reinforce the LSI chip, and use a substrate material with substantially the same thermal expansion coefficient.

18, FQFP (fine pitch quad flat package)

Small pin center distance QFP. Usually refers to a QFP with a lead center distance less than 0.65mm (see QFP). Some conductor manufacturers use this name.

19, CPAC (globe top pad array carrier)

The American Motorola Company's nickname for BGA (see BGA).

20, CQFP (quad fiat package with guard ring)


Four-side lead flat package with guard ring. One of the plastic QFPs, the pins are masked with a resin protection ring to prevent bending and deformation. Before assembling the LSI on the printed circuit board, cut the lead from the guard ring and make it into a seagull wing shape (L shape). This kind of package is made in Motorol in the U.S.

a The company has mass production. The pin center distance is 0.5mm, and the number of pins is about 208 at most.

21, H-(with heat sink)

means a mark with a radiator. For example, HSOP means SOP with heat sink.

22, pin grid array(surface mount type)


Surface mount PGA. Usually PGA is a plug-in package with a pin length of about 3.4mm. The surface mount PGA has display-like pins on the bottom surface of the package, and the length ranges from 1.5mm to 2.0mm. Mounting uses the method of butt welding with the printed circuit board, so it is also called butt welding PGA. Because the pin center distance is only 1.27mm, which is half smaller than the plug-in type PGA, the package body can be made not so large, and the number of pins is more than that of the plug-in type (250~528), which is a package for large-scale logic LSI . The packaging substrates include multilayer ceramic substrates and glass epoxy resin printing bases. The packaging of multilayer ceramic substrates has been put into practical use.


23, JLCC (J-leaded chip carrier)

J-shaped pin chip carrier. Another name for CLCC with window and ceramic QFJ with window (see CLCC and QFJ). The name adopted by some semiconductor manufacturers.

24, LCC (Leadless chip carrier)


Leadless chip carrier. Refers to a surface-mount package in which the four sides of the ceramic substrate are only in contact with electrodes without leads. It is a package for high-speed and high-frequency IC, also known as ceramic QFN or QFN-C (see QFN).

25, LGA (land grid array)


Contact display package. That is, a package with array state electrode contacts is made on the bottom surface. Just plug in the socket when assembling. Ceramic LGAs with 227 contacts (1.27mm center distance) and 447 contacts (2.54mm center distance) have been practically used in high-speed logic LSI circuits. Compared with QFP, LGA can accommodate more input and output pins in a smaller package. In addition, since the impedance of the lead is small, it is very suitable for high-speed LSI. However, due to the complicated production and high cost of sockets, they are basically not used much now. It is expected that its demand will increase in the future.

26, LOC(lead on chip)

Lead on chip package. One of the LSI packaging technologies, a structure in which the front end of the lead frame is above the chip, and bump solder joints are made near the center of the chip, and wire stitching is used for electrical connection. Compared with the original structure where the lead frame is arranged near the side of the chip, the chip contained in the same size package is about 1mm wide.


27, LQFP (low profile quad flat package)

Thin QFP. Refers to the QFP with a package body thickness of 1.4mm, which is the name used by the Japanese Electronic Machinery Industry according to the new QFP form factor formulated.

28, L-QUAD

One of ceramic QFP. Aluminum nitride used for packaging substrates has a thermal conductivity 7-8 times higher than that of aluminum oxide and has better heat dissipation. The frame of the package is aluminum oxide, and the chip is sealed by potting, thereby suppressing the cost. It is a package developed for logic LSI, which can tolerate W3 power under natural air cooling conditions. 208-pin (0.5mm center distance) and 160-pin (0.65mm center distance) LSI logic packages have been developed, and mass production began in October 1993.


29, MCM (multi-chip module)

Multi-chip components. A package in which multiple semiconductor bare chips are assembled on a wiring substrate. According to the substrate material, it can be divided into three categories: MCM-L, MCM-C and MCM-D. MCM-L is a component using a common glass epoxy multilayer printed circuit board. The wiring density is not very high and the cost is low. MCM-C uses thick film technology to form multilayer wiring, and uses ceramic (alumina or glass ceramic) as a substrate component, which is similar to a thick film hybrid IC using a multilayer ceramic substrate. There is no obvious difference between the two. The wiring density is higher than MCM-L.


MCM-D is the use of thin film technology to form multilayer wiring, with ceramic (aluminum oxide or aluminum nitride) or Si, Al as the substrate assembly. The wiring scheme is the highest among the three components, but the cost is also high.

30, MFP (mini flat package)

Small flat package. Another name for plastic SOP or SSOP (see SOP and SSOP). The name adopted by some semiconductor manufacturers.

31, MQFP (metric quad flat package)

A classification of QFP in accordance with JEDEC (United Electronic Equipment Council) standards. Refers to the standard QFP with a lead center distance of 0.65mm and a body thickness of 3.8mm~2.0mm (see QFP).


32, MQUAD (metal quad)

A QFP package developed by Olin Company in the United States. Both the base plate and the cover are made of aluminum and sealed with an adhesive. Under natural air cooling conditions, 2.5W~2.8W power can be tolerated. Japan's Shinko Electric Industry Co., Ltd. obtained a license in 1993 to start production.

33, MSP (mini square package)

Another name for QFI (see QFI), it was often called MSP in the early stages of development. QFI is the name prescribed by the Japan Electronic Machinery Industry Association.

34, OP(over molded pad array carrier)

Molded resin sealing bump display carrier. The name adopted by the American Motorola Company for molded resin sealing BGA (see BGA).


35, P-(plastic)

represents the symbol of plastic package. For example, PDIP means plastic DIP.

36, PAC (pad array carrier)

bump display carrier, another name for BGA (see BGA).

37, PCLP (printed circuit board leadless package)

Printed circuit board leadless package. The name adopted by Fujitsu for plastic QFN (plastic LCC) (see QFN). There are two sizes of pin center distance: 0.55mm and 0.4mm. It is currently in the development stage.

38, PFPF(plastic flat package)

Plastic flat package. Another name for plastic QFP (see QFP). The name adopted by some LSI manufacturers.

39, PGA (pin grid array)


Display pin package. One of the plug-in packages, the vertical pins on the bottom surface are arranged in an array. Packaging substrates basically use multilayer ceramic substrates. In the case where the material name is not specifically indicated, most of them are ceramic PGA, which is used in high-speed large-scale logic LSI circuits. higher cost. The center distance between pins is usually 2.54mm, and the number of pins ranges from 64 to 447. In order to reduce costs, the packaging substrate can be replaced by a glass epoxy printed substrate. There are also plastic PGAs with 64 to 256 pins. In addition, there is a short-pin surface-mount PGA (butt-welded PGA) with a pin center distance of 1.27mm. (See surface mount PGA).

40, piggy back

Carry package. Refers to the ceramic package with socket, the shape is similar to DIP, QFP, QFN. It is used to evaluate the program confirmation operation when developing equipment with a microcomputer. For example, plug the EPROM into the socket for debugging. This kind of package is basically custom-made, and it is not circulated in the market.


41, PLCC (plastic leaded chip carrier)

Plastic chip carrier with leads. One of surface mount packages. The pins are led out from the four sides of the package in a T-shape and are made of plastic. Texas Instruments in the United States first adopted 64k-bit DRAM and 256kDRAM, and now it has been widely used in logic LSI, DLD (or process logic device) and other circuits. The pin center distance is 1.27mm, and the number of pins ranges from 18 to 84. J-shaped pins are not easy to deform and easier to operate than QFP, but the visual inspection after soldering is more difficult. PLCC is similar to LCC (also known as QFN). In the past, the only difference between the two was that the former used plastics and the latter used ceramics. But now there are J-shaped lead packages made of ceramics and leadless packages made of plastics (marked as plastic LCC, PC LP, P-LCC, etc.), and it is no longer possible to distinguish them. For this reason, the Japanese Electronic Machinery Industry Association decided in 1988 to call the package with J-shaped pins drawn from four sides as QFJ, and the package with electrode bumps on four sides as QFN (see QFJ and QFN).


42, P-LCC(plastic teadless chip carrier)(plastic leaded chip currier)

is sometimes another name for plastic QFJ, sometimes it is another name for QFN (plastic LCC) (see QFJ and QFN). part

LSI manufacturers use PLCC for leaded package, and P-LCC for leadless package to show the difference.

43, QFH(quad flat high package)

Four-side lead thick body flat package. A type of plastic QFP. In order to prevent the package body from breaking, the QFP body is made thicker (see QFP). The name adopted by some semiconductor manufacturers.


44, QFI (quad flat I-leaded packgac)

Four-side I-shaped lead flat package. One of surface mount packages. The pins are led out from the four sides of the package and form an I-shape downwards. Also called MSP (see MSP). The mounting and the printed circuit board are connected by butt soldering. Because the pins have no protruding parts, the mounting area is smaller than QFP. Hitachi Manufacturing Co., Ltd. has developed and used this package for video analog ICs. In addition, Japan's Motorola Company's PLL IC also uses this package. The pin center distance is 1.27mm, and the number of pins ranges from 18 to 68.

45, QFJ (quad flat J-leaded package)

Four-side J-lead flat package. One of surface mount packages. The pins are led out from the four sides of the package and have a J-shape downwards. It is the name prescribed by the Japan Electronic Machinery Industry Association. The pin center distance is 1.27mm.

There are two kinds of materials: plastic and ceramic. Plastic QFJ is called PLCC (see PLCC) in most cases, and is used in circuits such as microcomputers, door displays, DRAM, ASSP, and OTP. The number of pins ranges from 18 to 84. Ceramic QFJ is also called CLCC, JLCC (see CLCC). Packages with windows are used for ultraviolet erasable EPROM and microcomputer chip circuits with EPROM. The number of pins ranges from 32 to 84. 46, QFN (quad flat non-leaded package)


printed circuit board

Four-side leadless flat package. One of surface mount packages. It is now called LCC. QFN is the name prescribed by the Japan Electromechanical Industry Association. The four sides of the package are equipped with electrode contacts. Because there are no leads, the mounting area is smaller than QFP and the height is lower than QFP. However, when stress is generated between the printed circuit board and the package, it cannot be relieved at the electrode contact. Therefore, it is difficult to make electrode contacts as many QFP pins, generally from 14 to 100. There are two kinds of materials: ceramic and plastic. When there is an LCC mark, it is basically ceramic QFN. The electrode contact center distance is 1.27mm.


Plastic QFN is a low-cost package of glass epoxy printed substrate substrate. In addition to 1.27mm, there are two types of electrode contact center distance: 0.65mm and 0.5mm. This kind of package is also called plastic LCC, PCLC, P-LCC, etc.

47, QFP (quad flat package)

Four-side pin flat package. One of the surface mount packages, the pins are led out from four sides in a seagull wing (L) shape. There are three kinds of substrates: ceramic, metal and plastic. In terms of quantity, plastic packaging accounts for the vast majority. When the material is not specified, it is plastic QFP in most cases. Plastic QFP is the most popular multi-pin LSI package. Not only used in digital logic LSI circuits such as microprocessors and gate displays, but also in analog LSI circuits such as VTR signal processing and audio signal processing. The pin center distance has various specifications such as 1.0mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm and so on. The maximum number of pins in the 0.65mm center distance specification is 304. Japan calls QFPs with a lead center distance less than 0.65mm as QFP (FP). But now the Japanese Electronic Machinery Industry will re-evaluate the form factor of QFP. There is no difference in the lead center distance, but according to the thickness of the package body, it is divided into three types: QFP (2.0mm~3.6mm thick), LQFP (1.4mm thick) and TQFP (1.0mm thick).


In addition, some LSI manufacturers call the QFP with a pin center distance of 0.5mm as shrink QFP or SQFP or VQFP. However, some manufacturers refer to QFPs with a pin center distance of 0.65mm and 0.4mm as SQFP, which makes the name somewhat confusing. The disadvantage of QFP is that when the lead center distance is less than 0.65mm, the lead is easy to bend. In order to prevent pin deformation, several improved QFP varieties have appeared. For example, the four corners of the package are BQFP with tree finger cushions (see BQFP); GQFP with resin protection ring covering the front end of the pin (see GQFP); test bumps are set in the package body to prevent pin deformation TPQFP (see TPQFP) that can be tested in a dedicated fixture. In terms of logic LSI, many developed and highly reliable products are encapsulated in multilayer ceramic QFP. Products with a minimum pin center distance of 0.4mm and a maximum of 348 pins have also been introduced. In addition, there are also glass-sealed ceramic QFPs (see Ge