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IC Substrate

IC Substrate

IC Substrate

IC Substrate

  • BGA IC Substrate
    BGA IC Substrate

    Product Name: BGA IC substrate

    Plate: Mitsubishi Gas HF BT HL832NX-A-HS

    Minimum width / spacing: 30 / 30um

    Surface: ENEPIG(2U)

    PCB thickness: 0.3mm

    Layer: 4Layers

    Structure: 1L-4L,1L-2L,3L-4L

    Solder mask ink: TAIYO PSR4000 AUS308

    Aperture: Laser hole 0.075mm, Mechanical hole 0.1mm

    Application: BGA IC substrate

    Product Details Data Sheet

    IC Substrate framework refers to a kind of key special basic material used for IC Substrate. It is mainly used to protect the chip and act as the interface between the IC chip and the outside world. Its form is ribbon, usually golden. The specific use process is as follows: first, the IC Substrate is pasted on the IC Substrate frame by the fully automatic mounter, then the contacts on the IC chip and the nodes on the IC Substrate frame are connected by the wire bonding machine to realize the circuit connection, and finally the IC chip is protected by the packaging material to form the IC Substrate, which is convenient for later application. The supply of IC Substrate framework depends on import.


    TAIYO PSR4000 AUS308 is a special ink for IC Substrate. It is easy to lose oil in the pre-treatment of super coarsening and Zonghua. The ink is delicate. The pre-treatment adopts sandblasting + Super coarsening. The nickel palladium process does not lose oil. The color is very beautiful. The copper surface must be cleaned. The roughness is not very important. The adhesion is good. Sandblasting must be used to minimize the difference of copper surface, Parameters of plug hole plate: 75 ℃ for 1 hour, 95 ℃ for 1 hour, 110 ℃ for 1 hour, then 150 ℃ for 50 minutes, baking for 25 minutes after printing text, horizontal drying section after text, 180 degrees. Note: the effect of pozzolanic is worse than sandblasting. It doesn't need to be too hard to eliminate the difference between local copper surface and local copper surface. Just like the color difference of gold surface, it only needs a little bit of sandblasting. The emery can be a little thicker, 280 mesh.


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.

    Product Name: BGA IC substrate

    Plate: Mitsubishi Gas HF BT HL832NX-A-HS

    Minimum width / spacing: 30 / 30um

    Surface: ENEPIG(2U)

    PCB thickness: 0.3mm

    Layer: 4Layers

    Structure: 1L-4L,1L-2L,3L-4L

    Solder mask ink: TAIYO PSR4000 AUS308

    Aperture: Laser hole 0.075mm, Mechanical hole 0.1mm

    Application: BGA IC substrate


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.