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IC Substrate

IC Substrate

IC Substrate

IC Substrate

  • Sensor IC Substrate
    Sensor IC Substrate

    Product Name: Sensor IC Substrate

    Material: Shengyi SI10U

    Minimum width / spacing: 35 / 35um

    Surface: Immersion Gold

    PCB thickness: 0.25mm

    Layer: 4Layers

    Structure: 1L-4L,1L-2L,3L-4L

    Solder mask ink: TAIYO PSR4000 AUS308

    Aperture: Laser hole 0.075mm, Mechanical hole 0.1mm

    Application: Sensor IC Substrate

    Product Details Data Sheet

    Shengyi si10u features: low CTE, high modulus, can effectively reduce the warpage of Sensor IC Substrate, excellent heat and moisture resistance, good PCB processability, halogen-free material, tg280.

    Sensor IC Substrate

    Sensor IC Substrate

    Let"s start with a brief introduction to MEMS sensors: the full name of MEMS is micro-electro-mechanical system. Micro-electro-mechanical system refers to those that can be produced in batches, combining micro-mechanisms, micro-sensors, micro-actuators, signal processing and control circuits, up to interfaces, Communication and power supply are equal to an integrated micro device or system. You can understand it as a technology that uses traditional semiconductor processes and materials to manufacture micro-machines on a chip with micron technology, and integrate it with the corresponding circuit as a whole. So it is an advanced manufacturing technology platform developed based on semiconductor manufacturing technology.


    Advantages of MEMS sensors: Compared with traditional machinery, their size is smaller, the largest is no more than one centimeter, or even only a few microns, and their thickness is even smaller. It uses silicon-based materials with excellent electrical properties. The strength, hardness and Young's modulus of silicon materials are equivalent to iron, the density is similar to aluminum, and the thermal conductivity is close to molybdenum and tungsten. Using the generation technology similar to the integrated circuit (IC), mature technology and craftsmanship in IC production can be used in large quantities and low-cost production, so that the cost performance is greatly improved compared with the traditional "mechanical" manufacturing technology.


    Traditional microphones and MEMS microphones integrate seven or eight mechanical parts into a small MEMS sensor chip. So the volume is very small and the weight is very light. Because it is a chip manufacturing, it has good consistency and low power consumption, making it easier to mass produce. But the technical requirements are very high. The emergence of MEMS sensors greatly meets everyone's requirements for small size and high performance.


    And this powerful chip is made using Sensor IC Substrate. MEMS sensors use Sensor IC Substrate as the chip substrate for a reason. Let’s first look at the application areas of MEMS, and then why it’s better to use Sensor IC Substrate. Understood.


    With the development of electronic technology, the application fields of MEMS sensors are becoming more and more extensive, from the earliest industrial and military aviation applications to the ordinary consumer market. Military and aviation belong to the so-called high-value MEMS application fields, but the amount of these two fields is too small, about 40 million US dollars a year, and the room for growth is also limited. The value of MEMS devices in medical electronics is also good, and the average selling price of its sensors is much higher than other comparable MEMS fields. Overall, the annual operating income of the high-value MEMS industry will reach about 300 million US dollars. However, the most widely used applications belong to the automotive electronics industry and consumer electronics application markets, which account for more than 60% of the MEMS sensor market. Let's analyze these two main application areas below.


     One is automotive electronics. Everyone knows that the sensors on the car are basically on the control system, mainly collecting engine data, but the operating environment of the car is very harsh, high temperature, corrosion, dust and other factors may be possible. Causes the fragile sensor to fail. At this time, Sensor IC Substrate is needed to ensure the normal operation of the entire sensor.


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.

    Product Name: Sensor IC Substrate

    Material: Shengyi SI10U

    Minimum width / spacing: 35 / 35um

    Surface: Immersion Gold

    PCB thickness: 0.25mm

    Layer: 4Layers

    Structure: 1L-4L,1L-2L,3L-4L

    Solder mask ink: TAIYO PSR4000 AUS308

    Aperture: Laser hole 0.075mm, Mechanical hole 0.1mm

    Application: Sensor IC Substrate


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.