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IC Substrate

IC Substrate

IC Substrate

IC Substrate

  • HDI IC Substrate Board
    HDI IC Substrate Board

    Model:  HDI IC Substrate Board

    Material: SI10U

    Layers: 6L(2+2+2)

    Thickness: 0.6mm

    Single size: 35 * 35mm

    Resistance welding: PSR-4000 AUS308

    Surface treatment: ENEPIG

    Minimum aperture: 0.1mm

    Minimum line distance: 70um

    Minimum line width: 30um

    Application: HDI IC Substrate Board

    Product Details Data Sheet

    Features of SI10U(S)

    ● Low CTE and high modulus, which can effectively reduce the warpage of the package carrier

    ● Excellent heat and humidity resistance

    ● Good PCB processability

    ● Halogen-free materials


    Application field

    eMMC, DRAM

    AP, PA

    Dual CM

    Fingerprint, RF Module

    SI10U IC package substrate pcb board parameter specification

    ItemConditionUnitSI10U(S)
    TgDMA280
    Td5% wt. loss
    >400
    CTE (X/Y-axis)Before Tgppm/℃
    10
    CTE (Z-axis)
    α1/α2ppm/℃
    25/135
    Dielectric Constant 1) (1GHz)2.5.5.9-4.4
    Dissipation Factor 1) (1GHz)
    2.5.5.9-0.007
    Peel Strength1)1/3 OZ, VLP CuN/mm
    0.80
    Solder Dipping@288℃min>30
    Young's modulus50℃GPa26
    Young's modulus
    200℃GPa
    23
    Flexural Modulus1)50℃
    GPa
    32
    Flexural Modulus1)
    200℃
    GPa
    27
    Water Absorption1)
    A%0.14
    Water Absorption1)85℃/85%RH,168Hr%
    0.35
    Flammability
    UL-94Rating
    V-0
    Thermal Conductivity-W/(m.K)0.61
    Color--Black

    IC carrier board packaging frame refers to a key special basic material used for IC card module packaging. It mainly protects the chip and serves as the interface between the integrated circuit chip and the outside world. Its form is ribbon, usually golden yellow . The specific usage process is as follows: First, the IC card chip is attached to the IC card packaging frame by a fully automatic placement machine, and then the contacts on the IC chip are connected to the nodes on the IC card packaging frame with a wire bonding machine. The connection of the circuit, and finally the use of packaging materials to protect the integrated circuit chip to form an integrated circuit card module, which is convenient for subsequent applications.


    The IC carrier board is also a product based on the BGA (Ball Grid Array, ball-planting matrix array or ball-planting array) architecture. The manufacturing process is similar to that of PCB products, but the precision is greatly improved. The manufacturing process is different from PCB. IC substrate has become a key component in IC packaging, gradually replacing part of the lead frame (Lead Frame) application.

    An integrated circuit integrates a general-purpose circuit on a chip. It is a whole. Once it is damaged internally, the chip is also damaged. The PCB can solder the components by itself, and replace the components if it is broken.


    IC carrier board: generally the carrier board on the chip, the board is very small, usually the size of a 1/4 fingernail, the board is very thin 0.2~0.4mm, the material used is FR-5, BT resin, and the circuit is 2mil/ About 2mil. It is a high-precision board that used to be generally produced in Taiwan, but now it is trending towards the mainland. The industry's yield rate is 75%. The unit price of this kind of board is very high, generally buy according to PCS.


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.

    Model:  HDI IC Substrate Board

    Material: SI10U

    Layers: 6L(2+2+2)

    Thickness: 0.6mm

    Single size: 35 * 35mm

    Resistance welding: PSR-4000 AUS308

    Surface treatment: ENEPIG

    Minimum aperture: 0.1mm

    Minimum line distance: 70um

    Minimum line width: 30um

    Application: HDI IC Substrate Board


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.