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IC Substrate

IC Substrate

IC Substrate

IC Substrate

  • 4-layers DDR Substrate Board
    4-layers DDR Substrate Board

    Product Name: 4-layers DDR Substrate Board

    Material: Mitsubishi Gas Chemical HL832

    Layers: 4L

    Thickness: 0.25mm

    Copper thickness: 0.5oz

    Color: Green (AUS308)

    Surface treatment: Soft Gold

    Minimum aperture: 100um

    Minimum line distance: 75um

    Minimum line width: 50um

    Application: IC substrate board

    Product Details Data Sheet

    Characteristics of DDR package carrier

    High density junction structure

    Hole filling electroplating and hole stacking structure

    Various surface treatment methods

    Sheet and surface flatness requirements

    Resin filling

    Application process of DDR package carrier

    Semi addition method, laser drilling,

    Application of DDR package carrier

    Smart phones, computers, Internet of things products, message electronic products

    Typical properties of materials


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.

    Product Name: 4-layers DDR Substrate Board

    Material: Mitsubishi Gas Chemical HL832

    Layers: 4L

    Thickness: 0.25mm

    Copper thickness: 0.5oz

    Color: Green (AUS308)

    Surface treatment: Soft Gold

    Minimum aperture: 100um

    Minimum line distance: 75um

    Minimum line width: 50um

    Application: IC substrate board


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.