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IC Substrate

IC Substrate

IC Substrate

IC Substrate

  •  BGA IC Substrate Board
    BGA IC Substrate Board

    Model:  BGA IC Substrate Board

    Material: HL832NXA

    Layers: 2L

    Thickness: 0.2mm

    Single size: 35 * 25mm

    Resistance welding: PSR-4000 AUS308

    Surface treatment: Soft Gold

    Minimum aperture: 0.1mm

    Minimum line distance: 30um

    Minimum line width: 30um

    Application: BGA package IC Substrate PCB Board

    Product Details Data Sheet

    1. Micro-wiring technology realizes 30um/30um Line/Space

    2. The small-diameter VIA technology of laser forming realizes high-density wiring

    3. Use thermosetting synthetic resin with excellent reliability

    4. The corresponding surface treatment (Ni/Au, SAC Soldering, etc) can be implemented according to the packaging requirements

    5. Green products such as lead-free and fluorine-free can be provided

    BGA IC Substrate Board


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.

    Model:  BGA IC Substrate Board

    Material: HL832NXA

    Layers: 2L

    Thickness: 0.2mm

    Single size: 35 * 25mm

    Resistance welding: PSR-4000 AUS308

    Surface treatment: Soft Gold

    Minimum aperture: 0.1mm

    Minimum line distance: 30um

    Minimum line width: 30um

    Application: BGA package IC Substrate PCB Board


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.