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IC Substrate

IC Substrate

IC Substrate

IC Substrate

  • eMMC Package Substrate
    eMMC Package Substrate

    Model:  eMMC Package Substrate

    Material: HL832NS

    Layers: 4L

    Thickness: 0.21mm

    Single size: 11.5 * 13mm

    Resistance welding: PSR-4000 AUS308

    Surface treatment: Soft Gold

    Minimum aperture: 0.1mm

    Minimum line distance: 20um

    Minimum line width: 20um

    Application: eMMC Package Substrate PCB Board

    Product Details Data Sheet

    eMMC (Embedded MultiMedia Card) is a standard specification for embedded memory established by the MMC Association, mainly for mobile phone products. An obvious advantage of eMMC is that it integrates a controller in the package, which provides a standard interface and manages flash memory, allowing mobile phone manufacturers to focus on other parts of product development and shorten the time to market products. These characteristics are of equal importance to NAND suppliers who want to reduce the size and cost of photolithography.


    eMMC is currently the most popular local storage solution for mobile devices. The purpose is to simplify the design of mobile phone memory. Because the different brands of NAND Flash chips include Samsung, KingMax, Toshiba or Hynix, Micron, etc. Now, it is necessary to redesign according to the product and technical characteristics of each company. In the past, there was no technology that could be used for all NAND Flash chips of all brands.

    emmc

    And every time the NAND Flash process technology changes, including the evolution from 70 nanometers to 50 nanometers, and then to 40 nanometers or 30 nanometers, mobile phone customers have to redesign, but semiconductor products will be updated every year in process technology, and memory problems will also occur. This slows down the launch of new models of mobile phones, so the concept of eMMC that packs all the memory and the control chip that manages NAND Flash in one MCP has gradually become popular.


    The design concept of eMMC is to simplify the use of internal memory in mobile phones. The NAND Flash chip and control chip are designed into 1 MCP chip. Mobile phone customers only need to purchase eMMC chips and put them in new mobile phones without having to deal with other complicated NAND Flash. Compatibility and management issues, the biggest advantage is to shorten the time to market and research and development costs of new products, and accelerate the speed of product innovation.


    The manufacturing process and technology of Flash Flash are changing rapidly, especially after the TLC technology and manufacturing process have dropped to the 20nm stage, the management of Flash is a huge challenge. With eMMC products, main chip manufacturers and customers do not need to pay attention to the internal production and product changes of Flash. , As long as the flash memory is managed through the standard interface of eMMC. This can greatly reduce the difficulty of product development and speed up the time to market.


    eMMC can well solve the management of MLC and TLC, ECC debugging mechanism (Error Correcting Code), block management (Block Management), wear leveling storage block technology (Wear Leveling), block management (Command Management) , Low-power management, etc.


    The core advantage of eMMC is that manufacturers can save a lot of time for managing NAND Flash chips. They don’t have to care about the evolution of NAND Flash chip process technology and product upgrades, and they don’t have to consider which NAND Flash chip is used. In this way, eMMC can accelerate products. The time to market ensures the stability and consistency of the product.


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.

    Model:  eMMC Package Substrate

    Material: HL832NS

    Layers: 4L

    Thickness: 0.21mm

    Single size: 11.5 * 13mm

    Resistance welding: PSR-4000 AUS308

    Surface treatment: Soft Gold

    Minimum aperture: 0.1mm

    Minimum line distance: 20um

    Minimum line width: 20um

    Application: eMMC Package Substrate PCB Board


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.