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PCB Material List

PCB Material List - Doosan DS-7409 HG (KQ) IC Package substrate material

PCB Material List

PCB Material List - Doosan DS-7409 HG (KQ) IC Package substrate material

Doosan DS-7409 HG (KQ) IC Package substrate material

Doosan DS-7409 HG (KQ) IC Package substrate material is Low Df, Halogen & phosphorous free. Applications, Flip chip BoC & RF module

Doosan DS-7409 HG (KQ) IC Package substrate material

Glass Epoxy Laminates, which are widely used in industrial equipment, have been further refined and are helping to promote sustainable economic growth in an environmentally-friendly way in accordance with ongoing changes in our life style, and are the basis on which numerous environmentally-friendly products including mobile applications, computer systems, and car electronics have been developed and produced.


DS-7409

  • DS-7409S (N)


Material Properties of DS-7409
PropertyUnitTest ConditionTypical ValueTest Method
Tg degree CelsiusDSC170IPC-TM-650.2.4.25c


TMA165IPC-TM-650.2.4.24c
CTE Z-axisppm/ degree CelsiusAmbient to Tg41IPC-TM-650.2.4.41
Z-axis expansion%50 degree Celsius to 260 degree Celsius3.3IPC-TM-650.2.4.41
Decomposition temperature(5% wt loss) degree CelsiusTGA295IPC-TM-650.2.4.40
T-260minTMA7IPC-TM-650.2.4.24.1
T-288minTMA-IPC-TM-650.2.4.24.1
Dielectric constant(Resin content 50%)
C-24/23/50(1GHz)4.2IPC-TM-650.2.5.5.9
Dissipation factor(Resin content 50%)
C-24/23/50(1GHz)0.015IPC-TM-650.2.5.5.9
Peel strength(Standard profile 1oz)N/mmCondition A2.0IPC-TM-650.2.4.8
Water absorption%E-24/50+D-24/230.12IPC-TM-650.2.6.2.1