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PCB Material List - F4BTMS-2 Modified woven fabric glass Teflon copper-clad laminates with ceramic filler

PCB Material List

PCB Material List - F4BTMS-2 Modified woven fabric glass Teflon copper-clad laminates with ceramic filler

F4BTMS-2 Modified woven fabric glass Teflon copper-clad laminates with ceramic filler

F4BTMS-2 is the PTFE PCB composites, laminated by the Nano-ceramic filled reinforced with the ultra thin woven fiberglass, according to the scientific formulation and strict process control. On the basis of the original PTFE copper-clad laminates,the material formula and manufacturing process were improved. The content of fiberglass is very small, which can replace the same type of foreign high frequency circuit materials.


F4BTMS-2 Data sheet

Appearance

Meet the specification requirements for the laminate of microwave PCB by National and Military Standards.

Types

F4BTMS-2

Dielectric Constant

2.2±0.03 2.65±0.04 2.94±0.04 3.0±0.04

Dimension(mm)

305X460 460X610 500X600 460X1220

For special dimension,customized laminates is available.

Thickness and Tolerance(mm)

Dielectric thickness

0.127

0.254

0.508

0.762

1.016

1.524

2.29

Tolerance

±0.015

±0.02

±0.03

±0.04

±0.05

±0.05

±0.08

Special thickness can be customized.

Optional copper foil

Thickness: 0.5 OZ , 1OZ


Type: ED, VLP foil, HVLP foil, 50 Wresistive foil

Mechanical Strength

Peel strength (1oz copper)

>15N/cm

Thermal stress

After tin dipping, 280°C, 10s, ≧3times,no de-lamination and blister.

Chemical Property

According to the properties of laminate,the chemical etching method for PCB can be used. The dielectric properties of laminate are not changed.

Electrical Property

Name

Test condition

Unit

Value

Density

DK2.2

Normal atmospheric temperature

g/ cm3

2.18

DK2.65

Normal atmospheric temperature

g/ cm3

2.25

DK2.94, 3.0

Normal atmospheric temperature

g/ cm3

2.3

Moisture Absorption

Dip in the distilled water of 20±2°C for 24 hours

%

0.02

Operating Temperature

High-low temperature chamber

°C

-50~+260

Thermal Conductivity


W/m/k

0.72

CTE (typical)

-55 o~288oC DK2.2

ppm/oC

X

Y

Z

15

16

35

-55 o~288oC DK2.65

ppm/oC

X

Y

Z

12

13

25

-55 o~288oC DK2.94, 3.0

ppm/oC

X

Y

Z

10

11

22

Shrinkage Factor

2 hours in boiling water

%

<0.0002

Surface Resistivity

500V DC

Normal state

M.Ω

≥1*107

Constant humidity and temperature

≥1*106

Volume Resistivity

Normal state

MΩ.cm

≥1*108

Constant humidity and temperature

≥1*107

Thermal Coefficient of εr

-50 o~150oC

PPM/ oC

-20

Dissipation Factor DK2.2/2.65/2.94/3.0

10GHZ

Df

0.0011

UL Flammability Rating

94V-0

F4BTMS-2 Features:

1. Excellent dielectric constant tolerance and consistency,low dissipation factor;

2. The coefficient of dielectric constant and dielectric loss changing with temperature is smaller ,and the frequency stability is better.

3. The coefficient of thermal expansion in X / Y / Z direction is reduced, and the coefficient of thermal expansion in X / Y direction is consistent.

4. The thermal conductivity is increasing;
5. Good dimensional stability;
6. Good appearance and smooth surface;
7. Suitable for high frequency multilayer lamination; 8. Excellent heat resistance and adhesion.


F4BTMS-2 Application:

Aerospace devices, High reliability equipment, Military radar, Phased array antenna, Feed network antenna, Satellite communication equipment, Passive components, Base station antennas, Ground and air radar systems, GPS antenna, Power backplane, Multilayer PCB, and Bunching network.


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