Precision PCB Fabrication, High-Frequency PCB, High-Speed PCB, Standard PCB, Multilayer PCB and PCB Assembly.
The most reliable PCB & PCBA custom service factory.
The advantage of design for Microwave Circuit. using TP-1/2 here:
(1)The dielectric constant is stable and can be optional within the range of 3022 according to the design of circuit requirement. The operating temperature is -100 degree Celsius～+150 degree Celsius;
(2)The peel strength between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate. This substrate is created to offer customers easy for circuit processing,higher pass-rate of production,and the manufacturing cost is much lower than the ceramic substrate.
(3)Dissipation factor tgδ≤1*10-3,and the loss has a slight variation with the rise of the frequency.
(4)It is easy for mechanical manufacturing,including drill, punch, grind, cut, etching,etc.. For these,the ceramic substrate cannot be compared.
TP-1/2 Technical Specifications
Appearance | Smooth and neat on both sides: no stain,scratch and dent. | ||||||
Dimension and tolerance (mm) | Dimensions A*B(mm) | Tolerance | |||||
120*100, 150*150, 160*160, 180*180, 200*200,170*240 | -2 | ||||||
Thickness and Tolerance | |||||||
0.8±0.05,1.0±0.05,1.2±0.05,1.5±0.06,2.0±0.075,3.0±0.10,4.0±0.10,5.0±0.12,6.0±0.12,10.0±0.2 | |||||||
For special dimensions,customized lamination is available. | |||||||
Mechanical Strength | Peel strength | In normal state:≥6N/cm;In the environment of alternating humidity and temperature:≥4 N/cm . | |||||
Chemical Property | According to the properties of laminate,the chemical etching method for PCB can be used. The dielectric properties of materials are not changed. | ||||||
Electrical property | Name | Test condition | Unit | Value | |||
Density | Normal state | g/cm3 | 1.02.9 | ||||
Moisture Absorption | Dip in distilled water of 20±2 degree Celsius for 24 hours | % | ≤0.02 | ||||
Operating Temperature | High-low temperature chamber | degree Celsius | -100～+150(Processing temperature should not exceed 200 degree Celsius) | ||||
Thermal Conductivity | -55~288 degree Celsius | W /m /k | 0.6 | ||||
CTE | Temperature rise of 96 degree Celsius per hour | 6*10-5 | |||||
Shrinkage Factor | 2 hours in boiling water | % | 0.0004 | ||||
Surface Resistivity | 500V DC | Normal state | M.Ω | ≥1*107 | |||
Constant humidity and temperature | ≥1*105 | ||||||
Volume Resistivity | Normal state | MΩ.cm | ≥1*109 | ||||
Constant humidity and temperature | ≥1*106 | ||||||
Pin Resistance | 500V DC | Normal state | MΩ | ≥1*106 | |||
Constant humidity and temperature | ≥1*104 | ||||||
Surface dielectric strength | Normal state | Kv/mm | ≥1.5 | ||||
Constant humidity and temperature | ≥1.2 | ||||||
Dielectric Constant | 10GHZ | εr | 3,6, 9.6, 10.2, 10.5, 11, 16, 20, 22(±2%)(dielectric constant canbe customized) | ||||
Dissipation Factor | 10GHZ | Tgδ(εr 3-11) | ≤1*10-3 | ||||
Tgδ(εr 12-22) | ≤1.5*10-3 | ||||||
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1. Quick respond,24 hours online service
2. No MOQ requirement
3. Diverse capabilities
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