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PCB Material List

Rogers RO4400 Series(RO4450F, RO4460G2) material specification

PCB Material List

Rogers RO4400 Series(RO4450F, RO4460G2) material specification

Rogers RO4400 Series(RO4450F, RO4460G2) material specification

Rogers RO4400 Series(RO4450F, RO4450T, and RO4460G2) dielectric materials have long been used in combination with FR-4 cores and prepreg as a means to achieve a performance upgrade of standard FR-4 multi-layer designs.


Rogers RO4003C, Rogers RO4350B, and Rogers RO4000 LoPro glass reinforced hydrocarbon/ceramic laminates have been used in layers where RF/microwave frequency, dielectric constant (DK), or high-speed signal requirements dictate high-performance materials. FR-4 cores and prepreg are still commonly used to inexpensively formless critical signal layers.

RO4450F and RO4460G2 material specification

RO4450F and RO4460G2 material specification

RO4450F and RO4460G2 Features

Prepreg grades based on RO4000 series core materials

Low z-axis coefficient of thermal expansion ranging from 43 to 60 ppm/°C

Sequential lamination capable

Lead-free solder processing compatible

High-frequency thermoset prepreg compatible with FR-4 bond temperatures

High reliability plated through-hole


RO4450F and RO4460G2 Applications

Backhaul Radio

Power Amplifiers

Communications Systems