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Industry Leading, Standard Loss, Thermally Robust Epoxy Laminate and Prepreg
isola 370hr is the industry “best in class” lead-free compatible product for high-reliability applications across a wide range of markets.
isola 370hr laminates and prepregs, designed by Polyclad, are made using a patented high performance 180°C Tg FR-4 multifunctional epoxy resin system that is designed for multilayer PCB applications where maximum thermal performance and reliability are required. Isola manufacture isola 370hr laminates and prepregs with high-quality E-glass glass fabric for superior Conductive Anodic Filament (CAF) resistance. Isola 370hr provides superior thermal performance with a Low Coefficient of Thermal Expansion (CTE) and mechanical, chemical, and moisture resistance properties that equal or exceed the performance of traditional FR-4 materials.
isola 370hr is used in thousands of PWB designs and has proven to be best in class for thermal reliability, CAF performance, ease of processing, and proven performance on sequential lamination designs.
Typical Values of isola 370hr
| Property | Typical Value | Units | Test Method | |
|---|---|---|---|---|
| Metric (English) | IPC-TM-650 (or as noted) | |||
| Glass Transition Temperature (Tg) by DSC | 180 | °C | 2.4.25C | |
| Decomposition Temperature (Td) by TGA @ 5% weight loss | 340 | °C | 2.4.24.6 | |
| Time to Delaminate by TMA (Copper removed) | A. T260 B. T288 | 60 30 | Minutes | 2.4.24.1 |
| Z-Axis CTE | A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion) | 45 230 2.8 | ppm/°C ppm/°C % | 2.4.24C |
| X/Y-Axis CTE | Pre-Tg | 13/14 | ppm/°C | 2.4.24C |
| Thermal Conductivity | 0.4 | W/m·K | ASTM E1952 | |
| Thermal Stress 10 sec @ 288ºC (550.4ºF) | A. Unetched B. Etched | Pass | Pass Visual | 2.4.13.1 |
| Dk, Permittivity | A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz | 4.24 4.17 4.04 3.92 3.92 | None | 2.5.5.3 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline |
| Df, Loss Tangent | A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz | 0.0150 0.0161 0.0210 0.0250 0.0250 | None None None | 2.5.5.3 2.5.5.9 Bereskin Stripline 2.5.5.5 2.5.5.5 |
| Volume Resistivity | A. After moisture resistance B. At elevated temperature | 3.0 x 108 7.0 x 108 | MΩ-cm | 2.5.17.1 |
| Surface Resistivity | A. After moisture resistance B. At elevated temperature | 3.0 x 106 2.0 x 108 | MΩ | 2.5.17.1 |
| Dielectric Breakdown | >50 | kV | 2.5.6B | |
| Arc Resistance | 115 | Seconds | 2.5.1B | |
| Electric Strength (Laminate & laminated prepreg) | 54 (1350) | kV/mm (V/mil) | 2.5.6.2A | |
| Comparative Tracking Index (CTI) | 3 (175-249) | Class (Volts) | UL 746A ASTM D3638 | |
| Peel Strength | A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil] B. Standard profile copper 1. After thermal stress 2. At 125ºC (257ºF) 3. After process solutions |
1.25 (7.0) 1.14 (6.5) | N/mm (lb/inch) | 2.4.8C
2.4.8.3 2.4.8.3 |
| Flexural Strength | A. Length direction B. Cross direction | 90.0 77.0 | KSI | 2.4.4B |
| Tensile Strength | A. Length direction B. Cross direction | 55.9 35.6 | KSI | ASTM D3039 |
| Young's Modulus | A. Length direction B. Cross direction | 3744 3178 | KSI | ASTM D790-15e2 |
| Poisson's Ratio | A. Length direction B. Cross direction | 0.177 0.171 | None | ASTM D3039 |
| Moisture Absorption | 0.15 | % | 2.6.2.1A | |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | |
| Relative Thermal Index (RTI) | 130 | °C | UL 796 | |
