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isola 370hr data sheet

Industry Leading, Standard Loss, Thermally Robust Epoxy Laminate and Prepreg

isola 370hr is the industry's “best in class” lead-free compatible product for high-reliability applications across a wide range of markets.


isola 370hr laminates and prepregs, deigned by Polyclad, are made using a patented high performance 180°C Tg FR-4 multifunctional epoxy resin system that is designed for multilayer PCB applications where maximum thermal performance and reliability are required. isola manufacture isola 370hr laminates and prepregs with high quality E-glass glass fabric for superior Conductive Anodic Filament (CAF) resistance.  isola 370hr provides superior thermal performance with low Coefficient of Thermal Expansion (CTE) and the mechanical, chemical and moisture resistance properties that equal or exceed the performance of traditional FR-4 materials.


isola 370hr is used in thousands of PWB designs and has proven to be best in class for thermal reliability, CAF performance, ease of processing and proven performance on sequential lamination designs.


Typical Values of isola 370hr

PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC180°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss340°C2.4.24.6
Time to Delaminate by TMA (Copper removed)

A. T260

B. T288

60

30

Minutes2.4.24.1
Z-Axis CTE

A. Pre-Tg

B. Post-Tg

C. 50 to 260°C, (Total Expansion)

45

230

2.8

ppm/°C

ppm/°C

%

2.4.24C
X/Y-Axis CTEPre-Tg13/14ppm/°C2.4.24C
Thermal Conductivity0.4W/m·KASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)

A. Unetched

B. Etched

PassPass Visual2.4.13.1
Dk, Permittivity

A. @ 100 MHz

B. @ 1 GHz

C. @ 2 GHz

D. @ 5 GHz

E. @ 10 GHz

4.24

4.17

4.04

3.92

3.92

2.5.5.3

2.5.5.9

Bereskin Stripline

Bereskin Stripline

Bereskin Stripline

Df, Loss Tangent

A. @ 100 MHz

B. @ 1 GHz

C. @ 2 GHz

D. @ 5 GHz

E. @ 10 GHz

0.0150

0.0161

0.0210

0.0250

0.0250

2.5.5.3

2.5.5.9

Bereskin Stripline

2.5.5.5

2.5.5.5

Volume Resistivity

A. After moisture resistance

B. At elevated temperature

3.0 x 108

7.0 x 108

MΩ-cm2.5.17.1
Surface Resistivity

A. After moisture resistance

B. At elevated temperature

3.0 x 106

2.0 x 108

2.5.17.1
Dielectric Breakdown>50kV2.5.6B
Arc Resistance115Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)54 (1350)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
ASTM D3638
Peel Strength

A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]

B. Standard profile copper

    1. After thermal stress

    2. At 125ºC (257ºF)

    3. After process solutions


1.14 (6.5)


1.25 (7.0)

1.25 (7.0)

1.14 (6.5)

N/mm (lb/inch)

2.4.8C


2.4.8.2A

2.4.8.3

2.4.8.3

Flexural Strength

A. Length direction

B. Cross direction

90.0

77.0

ksi2.4.4B
Tensile Strength

A. Length direction

B. Cross direction

55.9

35.6

ksiASTM D3039
Young's Modulus

A. Length direction

B. Cross direction

3744

3178

ksiASTM D790-15e2
Poisson's Ratio

A. Length direction

B. Cross direction

0.177

0.171

ASTM D3039
Moisture Absorption0.15%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Relative Thermal Index (RTI)130°CUL 796