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What are the main characteristics of immersion gold circuit boards
2021-08-23
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Author:Aure

What are the main characteristics of immersion gold circuit boards

1. Because the crystal structure formed by the immersion gold board and the gold-plated board is different, the immersion gold will be golden yellower than the gold-plated plate, and the customers will be more satisfied.

2. The project will not affect the distance during compensation.

3. The flatness and stand-by life of the gold-plated circuit board are as good as the gold-plated board.

4. Because the crystal structure of immersion gold is denser than that of gold plating, it is not easy to produce oxidation.

5. Because the immersion gold circuit board only has nickel and gold on the pads, it will not produce gold wires and cause slight shortness.

6. Because there is only nickel and gold on the pads of the immersion gold circuit board, the solder mask on the circuit and the copper layer are more firmly combined.

What are the main characteristics of immersion gold circuit boards

7. Because the immersion gold circuit board only has nickel and gold on the pad, the signal transmission in the skin effect is on the copper layer and will not affect the signal.

8. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold is easier to weld than gold plating, and will not cause poor welding and cause customer complaints.

9. Because the crystal structure formed by immersion gold and gold plating is different, the stress of the immersion gold plate is easier to control, and for some products, it is more conducive to processing. At the same time, it is precisely because the immersion gold is softer than the gold plating, so the immersion gold circuit board is not wear-resistant as a gold finger.

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