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Multilayer circuit board manufacturers
2021-08-27
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Author:Aure

Multilayer circuit board manufacturers

   Multi-layer printed circuit board, as the name suggests, is a circuit board with more than two layers to be called multi-layer, so the pcb multi-layer board has more than two layers, such as four-layer PCB, six-layer circuit board, eight-layer circuit board and so on. Of course, some designs are three-layer or five-layer circuits, also called pcb multi-layer boards. Larger than the conductive wiring diagram of the double-layer circuit board, the layers are separated by insulating substrates. After each layer of circuit is printed, the circuit of each layer is overlapped by pressing. Then drill holes again, and the conduction between the lines of each layer is realized by the via holes.
 
The advantage of pcb multilayer printed circuit board is that the circuit can be distributed in multiple layers, so that more precise products can be designed. Or smaller products can be realized by pcb multi-layer boards. Such as: medical security, industrial control and other equipment are widely used. In addition, multi-layer can increase the flexibility of design, can better control the differential impedance and single-ended impedance, as well as the output of some signal frequencies.


Multilayer circuit board manufacturers

 
  Pcb multilayer printed circuit board is an inevitable product of the development of electronic technology in the direction of high speed, multi-function, large capacity and small volume. With the continuous development of electronic technology, especially the extensive and in-depth application of large-scale and very large-scale integrated circuits, and it is rapidly developing in the direction of high-density, high-precision, and high-level digitalization, its fine lines, small apertures, and blind holes are buried. Technologies such as hole height, plate thickness and aperture ratio can meet most of the needs of the current market. Therefore, the importance of double-sided pcb multilayer printed circuit boards to the future is indispensable. Combining the requirements of high performance, multi-function, high reliability, low loss, amplitude and phase consistency, miniaturization and light weight, it brings great difficulty to the PCB design and manufacture of multilayer microwave printed circuit boards. For this reason, the different functions of the PCB are designed on different layers, such as the microstrip line, strip line, low-frequency control line and other mixed signal lines combined in the same multi-layer structure, through multiple types of metallized holes Manufacturing to achieve DC interconnection.
 
  Vertical interconnection is the main way to realize the connection between circuits of different layers in microwave multilayer circuits. The vertical interconnection is mainly realized by metallized blind vias and buried vias. In view of the needs of PCB design, the inner layer of the same layer circuit will face the simultaneous interconnection with the upper and lower layers of the circuit. Therefore, the research of controlled depth drilling technology becomes inevitable.
 
  All kinds of metallized hole interconnect manufacturing
 
   In this research, according to the requirements of PCB design for interlayer interconnection, multiple metallized holes are required to be manufactured, including blind holes and metallized holes for back-to-back interconnection blind holes. The specific measures are as follows:
 
  Metalized hole making
 
   In view of the characteristics of the RT/duroid6002 microwave dielectric multilayer board (containing PTFE), the new plasma treatment technology is used, followed by hole metallization.
 
   Judgment: Metallographic slices can be made through the attached board graphics produced by the multilayer circuit board, and the reliability test can be carried out to verify its reliability.