Ultra-precision PCB Fabrication, High Frequency PCB, High Speed PCB, IC Substrate, Multilayer PCB and PCB Assembly.
The most reliable PCB custom service factory.
PCB News

PCB News

PCB News

PCB News

Process capability of fiber optic circuit board
2021-08-27
View:42
Author:Aure

Process capability of fiber optic circuit board

   One, product definition
 
   Fiber optic circuit boards are also called optoelectronic products, commonly known as optical communication products
 
  Scope of application
 
   Communication short-distance signal transmission.
 
   2. Product characteristics
 
   1. Ultra-small optical fiber circuit board (3-5 square centimeters);
 
  2. The precision is high. The small fiber optic circuit board also needs to encapsulate the IC, and some high-levels have blind buried vias and even HDI (Huawei 5G products are part of HDI second-order). Talk about the next second-order HDI design;
 
  3. The shape is attached and the tolerance is tight, and the iron shell is fixed, and the card is not tight when it is small, and it cannot be put in when it is large. (Some companies control according to the third-level standard, and the Huawei standard is higher than the third-level standard);
 
   4. Long and short golden finger craftsmanship.


Process capability of fiber optic circuit board

   3. Commonly used boards and accessories for optical fiber circuit boards
 
   1. Conventional FR-4 fiberglass circuit board, used in the old version many years ago;
 
  2, M6 sheet, partly used now in the upgraded version;
 
  3. Rogers, high signal frequencies are used more often, especially Huawei products.
 
  Four. Difficulties in the production process and electronic advantages.
 
   1. The shape of the optical fiber circuit board is complex, and the molding cost is high (the cost of outsourcing is about 4 cents and a square centimeter)
 
   2. Small batches and small drilling machines have high working costs (model factories are difficult to batch), and large batches are too small to be taken seriously.
 
  3. High appearance requirements. The copper plug hole must not be falsely exposed, and the gold surface must not be scratched. ——The plug hole is very full, and it is a professional user of sinking gold processing;
 
  4. The external dimension accuracy requirements are high, and the equipment must be good (otherwise it cannot be put in or loosened)-20 new-shaped machine tools;
 
  5. The line requires high precision, and the data transmission must be stable. ——LDI machine;
 
  6. Large quantity, frequent customer complaints, returns often occur, business service requirements are high (proficient in technology, understand the process, and can quickly solve problems), and the requirements for customer complaints and post cooperation are very high.
 
  The process capability of the circuit board.
 
   In short, it is easy to find a manufacturer that produces circuit boards, but it is really not easy to find a good multilayer circuit board manufacturer for fiber optic boards, because fiber optic boards have high requirements and complex shapes.