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Talking about the production process of each layer of circuit board
2021-08-28
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Author:Aure

Talking about the production process of each layer of circuit board

    This article mainly introduces: single-sided circuit board, double-sided circuit board sprayed tin plate, double-sided circuit board plated nickel gold, multilayer circuit board sprayed tin plate, multilayer circuit board nickel-plated gold, multilayer circuit board immersed nickel gold Board; The production process of each layer of circuit board is introduced in detail.
 
    1. Single-sided circuit board process: blanking and edging → drilling → outer layer graphics → (full board gold plating) → etching → inspection → silk screen solder mask → (hot air leveling) → silk screen characters → shape processing → test → inspection.
 
    2. The process flow of double-sided circuit board tin spraying board blanking and grinding → drilling → sinking copper thickening → outer layer graphics → tinning, etching tin removal → secondary drilling → inspection → silk screen solder mask → gold-plated plug → hot air Leveling→Silk-printed characters→Shape processing→Test→Inspection.
 
    3. The process flow of nickel and gold plating on double-sided circuit boards is blanking and grinding → drilling → heavy copper thickening → outer layer graphics → nickel plating, gold removal and etching → secondary drilling → inspection → silk screen solder mask → silk screen characters → Shape processing→test→inspection.
 
    4. Multi-layer circuit board tin spraying board process cutting edge grinding → drilling positioning hole → inner layer pattern → inner layer etching → inspection → blackening → lamination → drilling → heavy copper thickening → outer layer pattern → tinning , Etching tin removal→secondary drilling→inspection→screen printing solder mask→gold-plated plug→hot air leveling→screen printing characters→shape processing→test→inspection.


 

Talking about the production process of each layer of circuit board

    5. Multilayer circuit board nickel-gold plating process: blanking and edge grinding → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → lamination → drilling → sinking copper thickening → outer layer graphics → gold plating, Film removal and etching→secondary drilling→inspection→screen printing solder mask→screen printing characters→shape processing→test→inspection.
 
    6. Multi-layer circuit board nickel-gold plate process: blanking and edge grinding → drilling positioning hole → inner layer pattern → inner layer etching → inspection → blackening → lamination → drilling → sinking copper thickening → outer layer pattern → plating Tin, etching tin removal→secondary drilling→inspection→screen printing solder mask→electroless nickel deposition→screen printing characters→shape processing→test→inspection. 

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