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What material is the PCB board made of
2021-09-02
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Author:Aure

What material is the PCB board made of
 
What materials are used for PCB boards in a circuit board factory? This knowledge is big, and different circuit boards have different materials. The editor of the circuit board factory will briefly tell you about it!

1. Introduction to Copper Clad Laminate

The main material of printed circuit board (PCB) is copper clad laminate, and copper clad (copper clad) is composed of substrate, copper foil and adhesive. The substrate is an insulating layer board composed of polymer synthetic resin and reinforced materials; the surface of the substrate is covered with a layer of pure copper foil with high conductivity and good solderability, the usual thickness is 35-50/ma; the copper foil is covered on the substrate The copper clad laminate on one side is called a single-sided copper clad laminate, and the copper clad laminate with copper foil on both sides of the substrate is called a double-sided copper clad laminate; whether the copper foil can be firmly covered on the substrate is completed by an adhesive. The thickness of commonly used copper clad laminates are 1.0mm, 1.5mm and 2.0mm.


What material is the PCB board made of

The following types of copper clad laminates are commonly used:
FR-1 ──Phenolic cotton paper, this base material is generally called bakelite (more economical than FR-2)
FR-2 ──Phenolic cotton paper,
FR-3 ──Cotton paper, epoxy resin
FR-4──Woven glass, epoxy resin (glass fiber board commonly used in Shenzhen Zhongke Circuit)
FR-5 ──Glass cloth, epoxy resin
FR-6 ──Masked glass, polyester
G-10 ──Glass cloth, epoxy resin
CEM-1 ──Cotton paper, epoxy resin (flame retardant)
CEM-2 ──Cotton paper, epoxy resin (non-flame retardant)
CEM-3 ──Glass cloth, epoxy resin
CEM-4 ──Glass cloth, epoxy resin
CEM-5 ──Glass cloth, polyester
AIN ──Aluminum Nitride
SIC ──Silicon Carbide
There are also many types of copper clad laminates. According to different insulating materials, it can be divided into paper substrate, glass cloth substrate and synthetic fiberboard; according to different binder resins, it can be divided into phenolic, epoxy, polyester and polytetrafluoroethylene; it can be divided into general and special types according to the purpose. .

2. The structure and characteristics of copper clad laminates commonly used in China

(1) Copper clad phenolic paper laminate
It is a laminated product made of insulating impregnated paper (TFz-62) or cotton fiber impregnated paper (1TZ-63) impregnated with phenolic resin and then hot pressed. The adhesive tape on both surfaces can be attached with a single sheet of alkali-free glass impregnated cloth. Cover one side with copper foil. Mainly used as a printed circuit board in radio equipment.

(2) Copper clad phenolic glass cloth laminate
It is a laminated product made of alkali-free glass cloth impregnated with epoxy phenolic resin by hot pressing. One or both sides are coated with copper foil. It has the advantages of light weight, good electrical and mechanical properties, and convenient processing. The surface of the board is light yellow, if melamine is used as the curing agent, the surface of the board is light green and has good transparency. Mainly used as a printed circuit board in radio equipment with higher operating temperature and operating frequency.

(3) Copper clad PTFE laminate
It is a kind of copper-clad board made of PTFE board as the substrate, covered with copper foil and hot-pressed. Mainly used for printed boards in high frequency and ultra high frequency circuits.

(4) Copper clad epoxy glass cloth laminate
It is a commonly used material for hole metallized printed circuit boards.

(5) Soft polyester copper-clad film
It is a ribbon-shaped material made of polyester film and copper by hot pressing, and it is crimped into a spiral shape and placed inside the device during application. In order to reinforce or prevent moisture, it is often poured into a whole with epoxy resin. Mainly used as flexible printed circuit and printed cable, and can be used as a transition line for connectors.

The last thing to pay attention to is that at the same time, before the copper pour, first thicken the corresponding power connection: 5.0V, 3.3V, etc., in this way, a number of multi-deformation structures with different shapes are formed.

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