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PCB News - The reason for the formation of tin bead on PCB board is fully explained

PCB News

PCB News - The reason for the formation of tin bead on PCB board is fully explained

The reason for the formation of tin bead on PCB board is fully explained

2021-09-04
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Author:Aure

The reason for the formation of tin bead on PCB board is fully explained

During the process of PCB processing, there may be many small and small problems, including the electroplating delamination we mentioned before. Today we will take a look at another common problem-tin beads. At the same time, the editor will also bring you the reasons for the formation of PCB board tin beads for your reference.


When the PCB circuit board leaves the liquid solder, it is very easy to form tin beads. This is because when the PCB board and the tin wave are separated, they will be drawn into a tin pillar, but when the tin pillar is broken and dropped back to the tin tank, the solder will be spattered, and the solder will fall on the PCB board to form a tin bead. Therefore, when designing the tin wave generator and tin tank, attention should be paid to reducing the drop height of tin. The small drop height helps reduce tin dross and tin splashing.

The reason for the formation of tin bead on PCB board is fully explained


The second reason for the formation of tin beads is the outgassing of volatile substances in the PCB circuit board and the solder mask. If there are cracks in the metal layer of the through holes of the PCB circuit board, the volatilized gas after the heating of these substances will escape from the cracks and form tin beads on the component surface of the PCB circuit board.

The third reason for the formation of tin beads is related to flux. Flux will remain under the components or between the PCB circuit board and the carrier (tray for selective soldering). If the flux is not sufficiently preheated and burned out before the PCB circuit board touches the tin wave, tin spattering will occur and tin beads will be formed. Therefore, the preheating parameters recommended by the flux supplier should be strictly followed.
PCB board These are the three main reasons for the production of tin beads on PCB. Of course, there are many other small reasons that can also cause the production of tin beads. However, with the development of science and technology, technicians have begun to be rich in the production of tin beads. Experience, these experiences can also quickly help technicians find a way to deal with it. This may be the charm of science and knowledge.

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