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PCB News - What are the maintenance requirements for PCB plating process?

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PCB News - What are the maintenance requirements for PCB plating process?

What are the maintenance requirements for PCB plating process?

2021-09-07
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Author:Aure

What are the maintenance requirements for PCB plating process?

Circuit board factory: What are the maintenance requirements for PCB electroplating process? Let us understand together:


1. Small maintenance
  A. Add cleaned copper balls and tin balls; replace small tin bars.

  B, clean the fly bus, the fly bus seat, the anode rod, and the contact point between the hook and the anode rod.

  C. Add materials to each tank according to laboratory analysis, and replace the dilute sulfuric acid tank.

  D. Check whether the anode bag is damaged, and replace the damaged plate bag and hanger.

  E, drag the cylinder for half an hour with 10ASF and 20ASF current density.



What are the maintenance requirements for PCB plating process?

2. Major maintenance


  A, turn off the pump, filter pump, heating, swing, ammeter, oscillation, etc.

  B. Pour the copper potion into the storage tank.

  C. Rinse the copper cylinder with clean water.

  D. Take out the titanium basket bag, rinse it with clean water, and replace the worn out.

  E. Pour out the copper ball, soak the titanium basket with sulfuric acid and hydrogen peroxide solution, and rinse it with water.

  F. Use a white clean cloth to scrub the copper cylinder wall, scrub the copper seat and anode rod, use a sponge to absorb impurities at the bottom of the cylinder, and then rinse it with water.

  G. Put the cleaned copper balls into the titanium basket, then put on the cleaned titanium basket bag, and put it back to the designated position in the tank; add the cleaned copper balls to the remaining copper cylinder and titanium basket above the liquid level.

  H. Check whether the filter element in the filter pump has reached the replacement frequency, and replace the cleaned filter element if necessary.

  I. Pour the syrup into the copper tank, and add the liquid level to circulate and filter for 1 hour.

  J. After the production team informs the laboratory to analyze and adjust, use the scrap copper plate 10ASF, 15ASF, 20ASF, 25ASF current density to drag the cylinder for 1 hour.


3. Carbon treatment of copper cylinder


  During the electroplating process, the decomposition products of additives, the accumulation of dry film or the eluate of the plate will form the organic pollution of the plating solution. It needs to be treated with hydrogen peroxide-activated carbon to obtain a more thorough effect. This treatment is generally once half a year to once a year.


4. Maintenance of tin tank


  A. Take out the titanium basket, check the anode bag, and replace the worn out ones.

  B. Pour out the tin balls, clean the tin balls with 5% sulfuric acid, put them into the titanium basket, and put them into the specified position in the tank.

  C. Check whether the filter element in the filter pump reaches the replacement frequency.

  D. Use 1/3 of the carbon core for 2 hours a week and then change it back to the polypropylene filter.

  E. Clean the copper seat and cathode rod with a white clean cloth.

  F. After 1 hour of circulating filtration, the production team informs the laboratory to analyze and adjust the potion. The production team adjusts according to the analysis sheet, and drags the cylinder with a current density of 5ASF for 1 hour.

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