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What are the key points of quality control in Shenzhen PCBA processing flow?
2021-09-08
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Author:Aure

What are the key points of quality control in Shenzhen PCBA processing flow?

The PCBA processing process is complex, and quality control is a very important link, which has a decisive impact on product quality. So, what are the key points for quality control in PCBA processing?


1. SMT patch processing

       The quality control of solder paste printing and reflow temperature control is a key node in PCBA manufacturing. For high-precision circuit board printing with special and complex processes, laser stencils need to be used according to specific conditions. In addition, according to PCB manufacturing requirements and customer product characteristics, it may be necessary to increase U-shaped holes or reduce steel mesh holes. The temperature control accuracy of the reflow oven is very important for the wetting of the solder paste and the firmness of the stencil welding. It can be adjusted according to the normal SOP operation guide to minimize the quality defects of PCBA processing in the SMT process. In addition, strict implementation of the AOI test can greatly reduce the undesirable phenomena caused by human factors.


What are the key points of quality control in Shenzhen PCBA processing flow?

Two, DIP plug-in post welding

       The circuit board is the most important and final process in the processing stage. In the DIP plug-in post-welding process, the consideration of the furnace jig for wave soldering is very important. How to use the furnace fixture to improve the yield rate and reduce the poor soldering phenomenon, such as continuous tin, little tin, and tin shortage, requires the pcba processing plant to continuously summarize experience in practice and achieve technological upgrades in the process of experience accumulation.


Three, test and program firing

       In the previous DFM report, before the PCB processing, some suggestions should be provided to the customer, such as setting some key test points on the PCB for the PCB soldering test and the key to the continuity and connectivity of the subsequent PCBA processing circuit test. If conditions permit, you can communicate with customers, let them provide the back-end program, and then burn the PCBA program into the core master IC through the burner. In this way, the integrity of the entire PCBA can be tested and inspected more concisely through touch action, and defective products can be found in time.


Four, PCBA manufacturing test

       The test content generally includes ICT (circuit test), FCT (functional test), burn test (aging test), temperature and humidity test, drop test, etc.

       The above four points are the four key points of Shenzhen PCBA processing process quality control, I hope it will be helpful to you.