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The future trend of IC substrate
2021-09-10
View:19
Author:Frank




     How to maintain the independent controllability of the chip industry chain has recently been raised to an unprecedented height. With the emergence of a large number of backbone companies mastering core technologies in China's chip industry, such as upstream design Huawei HiSilicon, midstream chip manufacturing SMIC, and downstream packaging companies. As the international semiconductor industry continues to shift to the mainland, IC substrates will benefit from this process. Today, we will focus on this huge potential industry.
1. What is an IC carrier board
IC carrier board is a technology developed with the continuous progress of semiconductor packaging technology. In the mid-1990s, a new high-density IC packaging form represented by ball grid array packaging and chip size packaging came out. The board appeared as a new packaging carrier.
IC carrier board is developed on the basis of HDI board. As a high-end PCB board, it has the characteristics of high density, high precision, miniaturization, and thinness.
The IC carrier is also called a package substrate. In the field of high-end packaging, IC substrates have replaced traditional lead frames and become an indispensable part of chip packaging. It not only provides support, heat dissipation and protection for the chip, but also provides the chip and PCB motherboard. There is an electronic connection between the board and the board, which plays the role of "up and down linkage"; even passive and active devices can be embedded to realize certain system functions.

IC carrier board

pcb smt


Two, IC carrier board product introduction
IC substrate products are roughly divided into five categories: memory chip IC substrate, MEMS IC substrate, radio frequency module IC substrate, processor chip IC substrate, and high-speed communication IC substrate. They are mainly used in the field of mobile intelligence. Terminal, service/storage, etc.

IC carrier board

According to different packaging processes, IC substrates can be divided into wire-bonded IC substrates and flip-chip IC substrates. Among them, wire bonding (WB) is the use of thin metal wires, heat, pressure and ultrasonic energy to make the metal leads and chip pads and substrate pads tightly welded to achieve electrical interconnection between the chip and the substrate and between the chips. Information exchange. , Widely used in the packaging of radio frequency modules, memory chips, and MEMS devices;
Flip chip (FC) packaging is different from wire bonding. It uses solder balls to connect the chip to the substrate, that is, solder balls are formed on the pads of the chip, and then the chip is flipped and attached to the corresponding substrate. This is achieved by heating and melting the solder balls. The chip is combined with the substrate pad, and this packaging process has been widely used in the packaging of products such as CPU, GPU and Chipset.
Three, IC substrate industry analysis
The expansion of fab capacity has stimulated demand in the IC substrate market. The main task of the fab is to etch silicon wafers into wafers, which are the raw materials for chips. The demand and sales of wafers directly determine the number of chips that can be produced and indirectly determine the IC carrier board. destiny.
From 2018 to 2020, domestic new wafer fabs will directly increase the demand for IC substrates. Leading domestic PCB companies are bound to increase their investment in IC carrier boards, and the carrier board market will develop better in the competition.
At present, the global IC carrier board market has reached 8.311 billion U.S. dollars, and the corresponding storage IC carrier market share is about 13%, that is, the market size is about 1.1 billion U.S. dollars.
With the development of 5G technology and the continuous practice of the concept of the Internet of Things, 5G and the Internet of Things are expected to lead the world's fourth silicon content growth cycle, continue to drive the growth of the semiconductor industry, and drive the demand for upstream IC substrates and other materials. It is estimated that by 2025, the market scale of my country's IC substrate industry is expected to reach about 41.235 billion yuan.