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What is the difference between "nickel palladium gold" and "nickel gold electroplating"?
2021-09-11
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Author:Aure

What is the difference between "nickel palladium gold" and "nickel gold electroplating"?

Nickel, palladium, and gold is a non-selective surface processing process that uses a chemical method to deposit a layer of nickel, palladium and gold on the surface of the copper layer of the printed circuit in PCB proofing. The main process flow is oil removal-micro-etching-pre-dipping-activation-nickel deposition-palladium deposition-gold deposition-drying. There will be multi-stage water washing between each link for treatment. The mechanism of chemical nickel-palladium-gold reaction mainly includes oxidation-reduction reaction and displacement reaction. Among them, reduction reaction is easier to deal with thick palladium and thick gold products.

Electroless nickel-palladium-gold is an important surface treatment process in the printed circuit board industry, which is widely used in the production process of hard circuit boards (PCB), flexible circuit boards (FPC), rigid scrambled boards and metal substrates. It is also an important development trend of the surface treatment of the printed circuit board industry in the future.

In PCB proofing, the difference between chemical nickel-palladium-gold and electroplated nickel-gold penalties:

Electroplating nickel gold, through electroplating, make gold particles adhere to the PCB board, because of the strong adhesion, it is also called hard gold; in PCB proofing, using this process can greatly increase the hardness and wear resistance of the PCB. Effectively prevent the diffusion of copper and other metals, and can meet the requirements of hot-press welding and brazing.


What is the difference between

Same point:

1. All belong to an important surface treatment process in the field of printed circuit boards;
2. The main application field is wire bonding and connection technology, all of which are suitable for medium and high-end electronic circuit products.

difference:

shortcoming:
1. Chemical nickel-palladium-gold adopts ordinary chemical reaction process, and its chemical reaction rate is obviously lower than that of electroplating nickel-gold;
2. The chemical nickel-palladium-gold syrup system is more complicated, and has higher requirements for production management and quality management.

advantage:
1. The electroless nickel-palladium-gold adopts leadless gold plating process, which reduces the lead layout space. Compared with electroplated nickel-gold, it can deal with more precise and higher-end electronic circuits;
2. The comprehensive production cost of chemical nickel-palladium-gold is lower;
3. The chemical nickel-palladium-gold has no tip discharge effect, and has a higher advantage in the control of the arc rate of the gold finger;
4. Although the reaction rate of chemical nickel-palladium-gold is slow, because it does not require lead wires and electroplating lines to connect, the number of products produced at the same time in the same volume of tank is much larger than that of electroplated nickel-gold, so there is a great advantage in comprehensive production capacity. .

In PCB proofing, chemical nickel-palladium metal is a special process, which has a certain technical threshold and difficulty in operation, and some PCB manufacturers are unwilling to do it or rarely do it.