Ultra-precision PCB Fabrication, High Frequency PCB, High Speed PCB, IC Substrate, Multilayer PCB and PCB Assembly.
The most reliable PCB custom service factory.
PCB News

PCB News

PCB News

PCB News

PCB layout design review elements

    DFM requirements for layout


  1 The optimal process route has been determined, and all devices have been placed on the PCB board.

  2 The origin of the coordinates is the intersection of the left and bottom extension lines of the board frame, or the bottom left pad of the bottom left socket.

  3 The actual PCB size, positioning device location, etc. are consistent with the process structure element map, and the device layout of the area with restricted device height requirements meets the structure element map requirements.

  4 The position of the DIP switch, reset device, indicator light, etc. is appropriate, and the handle bar does not interfere with the surrounding devices.

  5 The outer frame of the board has a smooth arc of 197mil, or it can be designed according to the structural dimension drawing.

  6 The ordinary board has 200mil process edges; the left and right sides of the backplane have process edges greater than 400mil, and the upper and lower sides have process edges greater than 680mil. The device placement does not conflict with the window opening position.

  7 All kinds of additional holes that need to be added (ICT positioning hole 125mil, handle bar hole, oval hole and fiber holder hole) are all missing and set correctly.

  8 The device pin pitch, device direction, device pitch, device library, etc. that have undergone wave soldering processing take into account the requirements of wave soldering processing.

  9 The device layout spacing meets the assembly requirements: surface mount devices are greater than 20mil, IC is greater than 80mil, and BGA is greater than 200mil.

  10 The crimping part has a device with a distance higher than that of the component surface greater than 120mil, and there is no device in the through area of the crimping part on the welding surface.

  11 There are no short devices between high devices, and no chip devices and short and small interposing devices are placed within 5mm between devices with a height greater than 10mm.

  12 Polar devices are marked with polarity silkscreen. The X and Y directions of the same type of polarized plug-in components are the same.

  13 All devices are clearly marked, no P*, REF, etc. are not clearly marked.

  14 There are 3 positioning cursors on the surface containing SMD devices, which are placed in an "L" shape. The distance between the center of the positioning cursor and the edge of the board is greater than 240 mils.

  15 If you need to do boarding processing, the layout is considered to be easy to make up, and it is convenient for PCB processing and assembly.

  16 The chipped edges (abnormal edges) should be filled in by milling grooves and stamp holes. The stamp hole is a non-metallized void, generally 40 mils in diameter and 16 mils from the edge.

  17 The test points used for debugging have been added in the schematic diagram, and they are placed appropriately in the layout.

Thermal design requirements for layout
  18 Heating components and exposed components of the casing should not be in close proximity to wires and heat-sensitive components, and other components should also be properly kept away.

  19 The placement of the radiator takes into account the problem of convection. There is no interference of high components in the projection area of the radiator, and the range is marked on the mounting surface with silk screen.

  20 The layout takes into account the reasonable and smooth heat dissipation channels.

  21 The electrolytic capacitor is properly separated from the high-heat device.

  22 Consider the heat dissipation problem of high-power devices and devices under the subboard.

Signal integrity requirements for layout
  23 The start-end matching is close to the sending device, and the end matching is close to the receiving device.

  24 Decoupling capacitors are placed close to related devices

  25 The crystal, crystal oscillator and clock driver chip are placed close to related devices.

  26 High-speed board and low-speed, digital and analog are arranged separately according to the module.

  27 Determine the topological structure of the bus based on the analysis and simulation results or the existing experience to ensure that the system requirements are met.

  28 If it is to modify the PCB board design, simulate the signal integrity problem reflected in the test report and give a solution.

  29 The layout of the synchronous clock bus system meets the timing requirements.

EMC requirements
  30 Inductive devices that are prone to magnetic field coupling, such as inductors, relays, and transformers, should not be placed close to each other. When there are multiple inductance coils, the direction is vertical and they are not coupled.

  31 In order to avoid electromagnetic interference between the soldering surface of the single board and the adjacent single board, no sensitive devices and strong radiation devices are placed on the soldering surface of the single board.

  32 The interface device is placed close to the edge of the board, and appropriate EMC protection measures have been taken (such as shielding shells, hollowing out of the power supply ground, etc.) to improve the EMC capability of the design.

  33 The protection circuit is placed near the interface circuit, following the principle of first protection and then filtering.

  34 The distance from the shielding body and the shielding shell to the shielding body and shielding cover shell is more than 500 mils for the devices with large transmitting power or particularly sensitive (such as crystal oscillators, crystals, etc.).

  35 A 0.1uF capacitor is placed near the reset line of the reset switch to keep the reset device and reset signal away from other strong interference devices and signals.

Layer setting and power ground splitting requirements
  37 When two signal layers are directly adjacent to each other, vertical wiring rules must be defined.

  38 The main power layer is adjacent to its corresponding ground layer as much as possible, and the power layer meets the 20H rule.

  39 Each wiring layer has a complete reference plane.

  40 Multilayer boards are laminated and the core material (CORE) is symmetrical to prevent warping caused by uneven copper density distribution and asymmetrical media thickness.

  41 The thickness of the board should not exceed 4.5mm. For the board thickness greater than 2.5mm (backplane greater than 3mm), the craftsman should confirm that there is no problem with the PCB processing, assembly and equipment, and the PC card board thickness is 1.6mm.

  42 If the thickness-to-diameter ratio of the via is greater than 10:1, it will be confirmed by the PCB manufacturer.

  43 The power and ground of the optical module are separated from other power and ground to reduce interference.

  44 The power and ground processing of key components meet the requirements.

  45 When impedance control is required, the layer setting parameters meet the requirements.

Power module requirements
  46 The layout of the power supply section ensures that the input and output lines are smooth and do not cross.

  47 When the single board supplies power to the subboard, the corresponding filter circuit has been placed near the power outlet of the single board and the power inlet of the subboard.

Other requirements
  48 The layout takes into account the overall smoothness of the wiring, and the main data flow is reasonable.

  49 According to the layout results, adjust the pin assignments of resistors, FPGAs, EPLDs, bus drivers and other devices to optimize the layout.

  50 The layout takes into account the appropriate increase of the space at the dense wiring to avoid the situation that cannot be routed.

  51 If special materials, special devices (such as 0.5mmBGA, etc.), and special processes are adopted, the delivery period and processability have been fully considered, and confirmed by PCB manufacturers and process personnel.

  52 The pin corresponding relationship of the sub-board connector has been confirmed to prevent the direction and orientation of the sub-board connector from being reversed.

  53 If there are ICT test requirements, consider the feasibility of adding ICT test points during layout to avoid difficulty in adding test points during the wiring phase.

  54 When high-speed optical modules are included, the layout gives priority to optical port transceiver circuits.

  55 After the layout is completed, a 1:1 assembly drawing has been provided for the project person to check whether the device package selection is correct against the device entity.

  56 At the window opening, the inner plane has been considered to be retracted, and a suitable no-wiring area has been set.