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In the era of 5G Internet, analysis of various reflow soldering processes to ensure high reliability of PCBA soldering!

In the era of 5G Internet, analysis of various reflow soldering processes to ensure high reliability of PCBA soldering!
With the continuous development of SMT electronic components to miniaturization, the integration of chips is getting higher and higher. Whether it is notebooks, smart phones, medical equipment, automotive electronics, military and aerospace products, array packaging BGA, CSP and other devices are increasingly used in products, and the quality requirements of products are also getting higher and higher.


5G is a hot word in 2019, but now the 5G era has begun. From the perspective of the PCBA circuit board of the mobile phone, compared with the 4G mobile phone, the design difficulty of the 5G mobile phone is mainly concentrated in the radio frequency and antenna, in addition to the baseband chip. Because the frequency of 5G is at least 1 time higher than 4G, 5 times the bandwidth of 4G, up to 29 frequency bands, 5 times higher than 4G power, 10 times higher than 4G speed, and dozens of times more antennas. This requires us to continuously improve process capabilities, increase high-end equipment, and ensure high product reliability through high-quality welding.


pcb board

Analysis of various processes for PCBA high-reliability welding


In the process of high-precision electronics manufacturing, there are many SMT production equipment. The main automation equipment is SMT automatic X-ray machine, SMT first detector, automatic solder paste printer, online 3 d-spi solder paste printing detector, SMT paste Chip machine, reflow soldering, online AOI light detector, online processing automatic milling cutter and so on.
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