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The "high speed" characteristics of the patch processing equipment in the smt factory
2021-10-04
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Author:Frank

The "high speed" characteristics of the patch processing equipment in the smt factory
At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If the PCB factory is determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and the PCB factory can get the opportunity to develop again.
With the rapid development of SMT chip processing, not only the size of components is getting smaller and smaller, the density of SMT chip components is getting higher and higher, but also new packaging forms are continuously introduced in order to adapt to the high-density and difficult circuit board assembly technology. The placement machine is developing towards high-speed, high-precision, multi-functional, modular and intelligent direction. Next, the editor of the smt factory will explain in detail the characteristics of the high-speed development direction of the SMT placement machine.

High speed of chip processing equipment
① "Flight alignment" technology. In-flight centering technology directly installs the CCD image sensor on the placement head and moves together to realize the optical centering of the components during the movement to the placement position of the printed circuit board after the device is picked up.

YAMAHA Mounter SMT

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②Modularization of high-speed SMT placement machine
③Two-way conveying structure. While retaining the performance of the traditional single-channel placement machine, the PCB conveying, positioning, detection, etc. are designed into a dual-channel structure. This dual-channel structure placement machine can be divided into synchronous and asynchronous modes. When operating in synchronous mode, the device placement of two printed boards of the same size is completed; when operating in asynchronous mode, when one printed board is performing device placement, the other printed board completes transmission, fiducial alignment, and bad board. Inspection and other steps to improve the production efficiency of the smt factory.

Automatic nozzle switching function. Some companies in Japan and Europe have made improvements to the placement head of the new placement machine, such as the use of a turntable and a double nozzle structure. The turntable structure automatically replaces the required suction nozzles during the movement of the placement head, and can pick up multiple components at the same time in a pick-and-place process, reducing the number of times the placement arm moves back and forth, thereby improving the work efficiency of the SMT placement machine.
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