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How to solve the overflow of FPC FLEXIBLE circuit board
Author:ipcber      Share

FPC flexible circuit board glue overflow refers to the glue line flow in COVERLAY due to the rising temperature in the pressing process, which results in the glue stain problem on the PAD of FPC flexible circuit board.
There are many reasons for the overflow of FPC FLEXIBLE circuit board, so we should propose different solutions according to the specific situation.
FPC flexible circuit board
1. Glue overflow is caused by the manufacturing process
Then, the FPC FLEXIBLE circuit board manufacturer should strictly inspect the incoming material. If the overflow exceeds the standard in the incoming material sampling inspection, contact the supplier to return or replace the goods. Otherwise, the overflow is difficult to control in the production process.
2. Glue overflow is caused by the storage environment
FPC flexible circuit board manufacturers had better establish a special refrigerator to preserve the protective film. If the CL adhesive system is affected by moisture because the preservation condition does not meet the requirements, low temperature can be used to pre-dry CL to a great extent to improve the amount of CL overflowing.
In addition, the CL that has not been used up on that day should be put back to the freezer in time for preservation.
3. Local glue overflow caused by independent small PAD position
This phenomenon is one of the most common quality anomalies encountered by most FPC FLEXIBLE circuit board manufacturers in China. If the process parameters are changed simply to solve the problem of rubber overflow, new problems such as insufficient bubble or peel strength will be brought, so the process parameters can only be adjusted reasonably.

4. Glue overflow caused by operation mode
During the false connection of FPC FLEXIBLE circuit board, employees shall be required to make accurate alignment, correct the alignment fixture, and increase the inspection intensity of alignment at the same time, so as to avoid glue overflow caused by inaccurate alignment.
At the same time, do a good job of "5S" when pressing the false connection, and check whether the protective film CL has pollution and burrs before alignment.