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The chip battle is the material battle
PCB News
The chip battle is the material battle

The chip battle is the material battle


   "New materials are the prerequisite for the high-quality development of manufacturing and weaponry equipment. In recent years, my country's material technology has developed rapidly, but the industrialization of high-level materials needs further development, and the technical barriers to high-end materials are increasingly emerging." At the recent Chinese Academy of Sciences Shenzhen At the inauguration ceremony of the Institute of Advanced Electronic Materials (in preparation) of the Advanced Technology Research Institute, Gan Yong, an academician of the Chinese Academy of Engineering and former vice president of the Chinese Academy of Engineering, called for researchers to take the lead in making breakthroughs in materials when talking about the "stuck neck" problem.


    Gan Yong said that the lack of integrated circuit manufacturing capacity and the lack of core technology are the main problems currently facing our country. In 2017, my country's server sales were about 2.55 million units, of which more than 98% were X86 servers. Although domestic manufacturers such as Huawei and Sugon accounted for the share of the main complete machines, more than 85% of the cost of hardware materials came from foreign suppliers. On the one hand, technology is constrained by others, on the other hand, the gross profit of the whole machine manufacturer is extremely low, and suppliers such as processors and memory have made high profits. Although domestically-made CPUs have reached or are close to the international advanced level, their craftsmanship is far behind the international advanced level. As soon as he changed the conversation, he said, "The chip battle is a material battle, and a breakthrough in the material of the'stuck neck' is imminent!"

    Information from the Shenzhen Advanced Institute of the Chinese Academy of Sciences shows that the Institute of Advanced Electronic Materials will have a total of three research centers, including a thermal management and heat dissipation materials research center, a wafer-level packaging key material research center, and a forward-looking research center, as well as a chip-level packaging key material There are 4 research rooms, including the research room, the electromagnetic shielding material research room, the dielectric material research room, and the material device simulation research room. Gan Yong is the director of the strategic guidance and advisory committee of the institute. is a subsidiary of Qinji Group and is a leading electronic industry service platform in China. It provides online components, sensor procurement, pcb customization, BOM distribution, material selection and other electronic industry supply chain complete solutions, one-stop to meet electronics The overall needs of small and medium-sized customers in the industry.

    According to reports, the Advanced Electronic Materials Research Institute established on the same day will undertake the construction of the Shenzhen Advanced Electronic Materials International Innovation Research Institute. Fan Jianping, dean of the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences and a doctoral supervisor at the University of Chinese Academy of Sciences, revealed that the Institute of Advanced Electronic Materials will use 5G communications as the engine, artificial intelligence, high-end communications and Internet of Things applications as its wings, and focus on advanced electronic materials. Research and industrialization are carried out, focusing on the deployment of key electronic materials for 5G communications.

    Gan Yong said that in the future, we need to focus on the following areas, including silicon and silicon-based materials, optoelectronic equipment and integration, the development of broadband communications and new networks. In his view, our country has entered the middle and late stages of industrialization. In the face of high-quality development needs, the problem of insufficient material foundation support is increasingly emerging. Without the core technology of materials, it is equivalent to building a house on someone else’s foundation, no matter how big it is.

The above is an introduction to the importance of chips and materials. Ipcb is also provided to PCB manufacturers and PCB manufacturing technology