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Common materials and plates for PCB circuit boards
PCB News
Common materials and plates for PCB circuit boards

Common materials and plates for PCB circuit boards


Copper Clad Laminate: COPPER CLAD LAMINATE, referred to as CCL by the pcb circuit board factory, or plate


Tg: Glass Transition Temperature, the glass transition temperature, is the temperature at which the glassy substance transforms between the glassy state and the high elastic state (usually softened). In the PCB industry, this glassy substance generally refers to the resin or Dielectric layer composed of resin and glass fiber cloth. Our company's commonly used common TG sheet requires Tg greater than 135°C, medium Tg requires greater than 150°C, and high TG requires greater than 170°C. The higher the Tg value, the better its heat resistance and dimensional stability.

CTI: Comparative Tracking lndex, relative leakage index (or comparative leakage index, tracking index). The highest voltage value at which the surface of the material can withstand 50 drops of electrolyte (0.1% ammonium chloride aqueous solution) without forming traces of electrical leakage, in V.

CTE: Coefficient of thermal expansion. The coefficient of thermal expansion usually measures the performance of PCB boards. It is defined as the ratio of the increase in length to the original length under a unit temperature change, such as Z-CTE. The lower the CTE value, the better the dimensional stability, and vice versa.

TD: thermal decomposition temperature refers to the temperature at which the base resin loses 5% of its weight when heated, and is a sign of delamination and performance degradation caused by the heat of the base material of the pcb rinted board.

CAF: Ion migration resistance. The ion migration of printed boards is the phenomenon of electrochemical insulation damage on the insulating substrate. It refers to the electrical The state in which dendritic metals are precipitated between, or the migration of metal ions (CAF) occurs along the surface of the glass fiber of the substrate, thereby reducing the insulation between the wires.

T288: It is a technical indicator that reflects the soldering resistance conditions of the printed board substrate. It refers to the longest time that the printed board substrate can withstand the welding high temperature at 288°C without decomposing such as blistering and delamination. The longer the time, the better the welding.

DK: dielectric constant, dielectric constant, often called dielectric constant.

DF: dissipation factor, dielectric loss factor, refers to the ratio of the energy lost in the insulating sheet in the signal line to the energy remaining in the line.

OZ: oz is the abbreviation of the symbol ounce. Chinese called "ounce" (translated as ounce in Hong Kong) is an imperial unit of measurement. When used as a unit of weight, it is also called English liang; 1OZ means that copper with a weight of 1OZ is evenly spread on 1 square foot. (FT2) The thickness reached on the area, it is the average thickness of the copper foil with the weight per unit area. Expressed by the formula, 1OZ=28.35g/ FT2.

Copper foil: COPPER FOIL

ED copper foil: electrolytic copper foil, copper foil commonly used in PCB, cheap,

RA copper foil: rolled copper foil, commonly used copper foil for FPC,

Drum Side: Smooth surface, smooth surface of electrolytic copper foil

Matt side: the matte side, the rough side of the electrolytic copper foil

Copper: element symbol Cu, atomic weight 63.5, density 8.89 g/cm3, and electrochemical equivalent of Cu2+ 1.186 g/Ah.

Semi-cured film: PREPREG, PP for short

Epoxy resin: an organic polymer compound containing two or more epoxy groups in the resin molecule, which is the resin component used in prepregs commonly used at present

DICY: Dicyandiamide, a common curing agent

R.C: resin content

R.F: resin flow

G.T: gel time

V.C: volatile content

Curing: The epoxy resin and curing agent undergo cross-linking polymerization under certain conditions (high temperature, high pressure or light) to form a polymer with a three-dimensional network structure.