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Material description of Multilayer PCB circuit board
PCB Blog
Material description of Multilayer PCB circuit board

Material description of Multilayer PCB circuit board

2022-01-05
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Author:pcb

Many practitioners in the multi-layer PCB circuit board industry know that there are many factors that affect the quality of PCB circuit board. For example, SMT patch processing equipment, process, technology, and PCB circuit board design are commonly known. Among them, the selection of the PCB board is also very important. Choosing the appropriate substrate material can not only effectively improve product performance, but also ensure product quality. So what are the baseboard materials of the multilayer PCB circuit board?


PCB circuit board

PCB circuit board

1. Classification

PCB PCB circuit board substrate materials are divided into two main categories:

1. Organic material substrates, including phenolic resin, glass fiber/epoxy resin (FR4), Polyimide, BT/Epoxy, etc.

2. Inorganic material substrates, including inorganic metal substrates (copper substrates, aluminum substrates, etc.) and ceramic substrates.


2. Advantage Analysis

1. Metal base plate: 0.3mm-2. Omm thick metal plates, such as aluminum, iron, copper, epoxy resin semi-cured sheets, and copper foil, are hot-composite pressed. The metal plate can be used for large-area patch processing and has the following performance features:

(1) Good mechanical performance: The metal substrates have good mechanical strength and toughness. Solve the brittleness of printed circuit boards based on inorganic materials. It is suitable for large-area patch processing and can withstand heavy component installation. In addition, the dimension stability and smoothness of the metal base material are its major advantages.

(2) Good heat dissipation: because the metal base plate and the semi-cured sheet are in direct contact, they have excellent heat dissipation performance. When using the metal substrate for patch processing, the heat generated during patch processing can be well dispersed. The heat dissipation capacity of the circuit board depends on the thickness of the metal substrate and the thickness of the resin layer. Of course, the design should also take into account the impact of electrical performance, such as electrical resistance.

(3) Can shield electromagnetic waves: In high-frequency circuits, designers are mainly concerned with the prevention of electromagnetic wave radiation, metal substrates can form a natural protective layer to achieve the purpose of shielding electromagnetic waves.


3. PCB Ceramic Substrate

Ceramic substrates: Ceramic substrates are widely used in power electronic circuits with the following advantages:

(1) Ceramic substrates have good electrical insulation performance, which is the basic performance of the substrates;

(2) Ceramic substrates also have high thermal conductivity, which can transfer heat generated by the circuit very well.

(3) Ceramic substrates also have excellent brazing performance, high adhesion strength, and high current carrying capacity.


PCB circuit board has many types of baseboard materials, each has its own advantages. It is necessary to select the appropriate baseboard materials according to the actual use and processing conditions to ensure the final product forming quality. IPCB will also continue to improve processes to provide customers with better PCB board processing services.