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PCBA Tech

PCBA Tech - Factors of poor PCB surface quality in PCBA processing

PCBA Tech

PCBA Tech - Factors of poor PCB surface quality in PCBA processing

Factors of poor PCB surface quality in PCBA processing

2021-08-10
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Author:ipcb

As the size of PCBA components becomes smaller and smaller, and the density becomes higher and higher; the support height between the device and the device (the distance between the PCB and the ground clearance) is also getting smaller and smaller, and environmental factors have an impact on the PCBA. The influence is getting bigger and bigger, iPCB puts forward higher requirements on the reliability of PCBA of electronic products. The following iPCB briefly introduces the factors that cause poor PCB surface quality during the production and PCBA processing process.


1. PCB substrate processing problems: especially some thin PCB substrates (usually below 0.8mm), because the rigidity of the PCB substrate is poor, it is not suitable for brushing with a brushing machine. In this way, during the production and processing of PCB substrates, it may not be possible to effectively remove the specially treated protective layer to prevent oxidation of the copper foil on the board surface. Although the layer is thin and easy to remove with a brush, it is difficult to chemically treat.


2. The phenomenon of poor surface treatment due to oil or other liquid contaminated with dust during machining (drilling, lamination, milling, etc.) of the PCB surface.


3. Poor sinking copper brushing: the pressure of the sinking copper front grinding plate is too large, causing hole deformation, brushing the hole copper foil rounded corners, and even leaking the substrate, causing sinking copper electroplating, spraying tin soldering, etc. There is blistering at the orifice; therefore, attention should be paid to strengthen the control of the brushing process, and the brushing process parameters should be adjusted to appropriate values through the wear scar test and the water film test.

PCBA

PCBA

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