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How to ensure the speed and quality of SMT fast proofing?
How to ensure the speed and quality of SMT fast proofing?

How to ensure the speed and quality of SMT fast proofing?


SMT processing manufacturers introduce how to improve the speed of SMT patch proofing and what preparatory work needs to be done

In the electronics manufacturing and processing industry, in addition to the frequent R&D template placement tasks, there are also cases of rapid smt proofing. When encountering urgent smt rapid proofing work, not only must the task be completed within the specified time, but also Quality is guaranteed. Next, SMT manufacturers will introduce how to improve the speed of SMT patch proofing and what preparations need to be done.

SMT quick proofing

How to improve the speed of SMT patch proofing while ensuring quality

  First, whether it is an urgent task or not, it is good to know how to increase the speed of SMT patch proofing, so that the work efficiency of SMT patch processing can also be improved. After encountering tasks that require rapid processing, you should ensure that you have prepared SMT patch processing data in advance, such as the bom of the patch, the location coordinates of the patch, the patch map and the template, etc., so that the patch can be prepared in advance Offline program.

 Second, the SMD materials provided must be exquisite. SMT patch proofing cannot be prepared. There are still problems with SMD materials. We must pay attention to the quantity of materials to the specific specifications and parameters of the materials, so that they will not be processed. Because there is a problem with the SMD material.

pcb board

Third, SMT patch proofing workshops are all in two shifts, and the information that needs to be marked on the bom must be marked, otherwise there is no way to ask if there are problems in the night shift. The original resistance of the incoming material should be marked with an accuracy of 1% or 5%, the voltage of the components should be stated for the incoming capacitors, and whether the IC chip, triode, etc. can be used instead, these should be noted on the bom, otherwise it is necessary to verify this information during SMT patch processing. It will affect the processing speed, so these preparations before processing cannot be ignored.

 Increasing the speed of SMT rapid proofing is naturally not only reflected in the preparations just mentioned before processing, but also as a technician during SMT patch processing, to ensure that the best state is taken to reduce the error rate, so as to ensure quality and quantity. Improve the processing speed of SMT patch.

SMT quick proofing mechanism

SMT chip processing capability

1. The largest board: 310mm*410mm (SMT);

2. Maximum board thickness: 3mm;

3. Minimum board thickness: 0.5mm;

4. The smallest Chip parts: 0201 package or parts above 0.6mm*0.3mm;

5. The maximum weight of mounted parts: 150 grams;

6. Maximum part height: 25mm;

7. Maximum part size: 150mm*150mm;

8. Minimum lead part spacing: 0.3mm;

9. The smallest spherical part (BGA) spacing: 0.3mm;

10. The smallest spherical part (BGA) diameter: 0.3mm;

11. Maximum component placement accuracy (100QFP): 25um@IPC;

12. Mounting capacity: 3 to 4 million points/day.