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Prospects and development of SMT processing and assembly
Prospects and development of SMT processing and assembly

Prospects and development of SMT processing and assembly


 In terms of the number of PCB layers and the direction of development, the PCB industry is divided into six primary sub-commodities such as PB single-sided boards, PCB double-sided boards, conventional multilayer boards, flexible boards, HDI (high-density interconnection) boards, and packaging substrates. From the perspective of the four cyclical dimensions of the commodity life cycle, such as the "introduction period-the growth period-the aging period-the decline period", single-panel and double-panel panels are not suitable for the current trend of short and frivolous use of electronic goods. The share is gradually reduced. Prosperous countries and regions such as Japan, South Korea and Taiwan of my country have rarely produced such products in their hometowns. Many large manufacturers have clearly stated that they will no longer accept single and double panels. Conventional multi-layer boards and HDI are classified as products in the aging period, so that the skills can become more sophisticated and the added value of the product is higher. It is now the main supply direction of most major PCB manufacturers. Only a few Chinese manufacturers such as ultrasonic electronics need to grasp the production skills; The abnormality of the sex board is the high-density flexible board and the rigid-rigid combination board. Because the current skills are not sophisticated, many manufacturers have not been able to produce in large quantities. It is attributed to the growth period of the product, but because it has the characteristics of being more suitable for digital products than rigid boards. , The growth of flexible boards is very high, which is the future development direction of major factories.

pcb board

The packaging substrates used in ICs, whether they are developed or manufactured in countries where the electronics industry is prosperous, such as Japan and South Korea, are more sophisticated, but they are still in a period of skill exploration in China. This is because my country’s IC industry is still not thriving. However, as multinational electronics giants continue to move IC development organizations to my country, as well as my country’s own IC development and production levels, packaging substrates will have a huge market, which is a visionary. The development direction of the factory.

my country's rigid boards (single-sided, double-sided, multi-layer, HDI boards) account for 70% of the total, among which multi-layer boards with a proportion of more than 50% account for the largest proportion, followed by soft boards with a proportion of 15.6%. Because of the pressure of oversupply, most manufacturers entered a price war, and the output growth was lower than expected.

From the perspective of the future development trend of domestic PCB products, the increase in output is slightly lower than the increase in sales. The first is that the product structure is gradually developed to multi-layer and high-precision. my country's multilayer board and HDI board are in the professional growth period, the plan is constantly expanding, and the skills are becoming more sophisticated. Multi-layer boards are still the main stream of market development; while HDI boards are being driven by the need for upgrading of downstream electronic information products, and are in a period of rapid development.

Comparative analysis of domestic and foreign shopping malls

PCB production companies are mainly distributed in six major regions of my country, Taiwan, Japan, South Korea, North America and Europe. The global printed circuit board profession is slack, with many manufacturers and no market leader.

Although my country is now ranked first in the world from the perspective of industrial planning, the overall skill level of the PCB industry still lags behind the international leader level. In terms of product structure, multi-layer boards account for most of the output share, but most of them are low-end products with less than 8 layers. HDI, flexible boards, etc. have certain plans, but they exist with leading foreign products such as Japan in terms of skill content. The IC carrier board with the highest technical content is very few companies in China that can produce it.

The number of foreign-funded companies in my country only accounts for 10% of the number of PCB companies in my country, but the output accounts for two-thirds of my country's PCB occupations. The products of Chinese companies gather in the low-end and middle-end, and there are not a few internationally well-known brands for professional companies.

Internationally known PCB companies, including PCB companies in the United States, Japan, Europe, Taiwan, and Hong Kong, have set up factories in mainland my country. After several years of painstaking efforts, some companies have entered the top 100 PCB professions in mainland my country.