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Understand the advantages and points of attention of SMT processing
PCBA Tech
Understand the advantages and points of attention of SMT processing

Understand the advantages and points of attention of SMT processing

2021-11-07
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Author:Downs

SMT chip processing has many advantages, such as high reliability, strong vibration resistance, small size, high assembly density, which can reduce costs and expenses, etc.; however, the placement machine equipment must be inspected regularly during processing.

SMT chip processing has many advantages, such as high reliability, strong anti-vibration ability, small size, high assembly density, which can reduce costs and expenses, etc.; but the chip placement machine equipment must be checked regularly during processing. It is to ensure that the patch will not be crooked and high throw-offs occur, so let's introduce the relevant content in detail for everyone.

1. The advantages of SMT chip processing

  1. High reliability and strong anti-vibration ability. SMT chip processing uses chip components with high reliability, small PCBA components and light weight, which has strong anti-vibration ability. It adopts automatic production and high installation reliability. Generally speaking, the defective solder joint rate is less than 10 parts per million, which is an order of magnitude lower than the wave PCB soldering technology of the through-hole plug-in unit, which can ensure that the defective rate of the solder joints of electronic products or components is low. At present, nearly 90% of electronic products use s-MT technology.

  2. pcb board

2. PCBA electronic products are small in size and high in assembly density

3. High-frequency characteristics and reliable performance. Because the chip components are firmly installed, lead-free or short leads are usually used, which reduces the influence of parasitic inductance and capacitance, improves the high-frequency characteristics of the circuit, and reduces electromagnetic and radio frequency interference. The higher frequency of the circuit designed by SMC and SMD is 3GHz, while the chip unit is only 500MHz, which can shorten the transmission delay time. It can be used in circuits with a clock frequency greater than 16mhz. If the MCM technology is adopted, the high-end clock frequency of the computer workstation can reach 100MHz, and the additional power consumption caused by parasitic reactance can be reduced by 2-3 times.

4. Improve production efficiency and realize automatic production. At present, in order to realize the complete automation of the perforated board, it is necessary to expand 40% of the original PCB area so that the plug-in head of the automatic plug-in can be inserted into the components, otherwise the space gap is not enough and the components will be damaged. The automatic sm421/sm411 adopts vacuum nozzle suction and exhaust parts. The vacuum nozzle is smaller than the component shape, but it increases the mounting density. In fact, small parts and small pitch QFPs are produced by automatic placement machines, realizing fully automatic production.

5. Reduce costs and expenses

(1) PCB area is 1/12 of the area of through-hole technology. If CSP is adopted, the area of PCB will be greatly reduced;

(2) Reduce the number of holes drilled on the PCB and save maintenance costs;

(3) Due to the improvement of frequency characteristics, the cost of circuit debugging is reduced;

(4) Due to the small size and light weight of chip components, packaging, transportation and storage costs are reduced;

(5) SMT chip processing technology can save materials, energy, equipment, manpower and time, and reduce costs by 30% to 50%.

2. Matters needing attention in smt patch processing

1. When performing smt patch processing, everyone knows that solder paste is basically applied. For the newly purchased solder paste, if it is not applied immediately, the SMT factory needs to store it in an environment of 5-10 degrees, so as not to affect the application of the solder paste. In a zero degree environment, it will not work if it is higher than 10 degrees.

2. When performing the placement process, the PCBA placement machine equipment must be checked regularly. If the SMT factory equipment is aging or some components are damaged, in order to ensure that the placement will not be pasted Crooked, high dumping occurs, the equipment needs to be repaired or replaced with new equipment in time. Only in this way can production costs be reduced and production efficiency improved.