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Advantages of FPC and SMT double-sided group method
PCBA Tech
Advantages of FPC and SMT double-sided group method

Advantages of FPC and SMT double-sided group method

2021-11-09
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Author:Downs

Advantages of FPC flexible circuit board

In the electronic product processing industry, circuit boards are divided into hard and soft. Traditional circuit boards are generally rigid circuit boards, while flexible circuit boards are printed circuit boards with special functions, mainly used in mobile phones, notebook computers, and PDAs. , Digital cameras, LCD screens and other products. So what are the advantages of FPC flexible circuit boards?

The flexible circuit board is a printed circuit board made of a flexible insulating substrate, which has many advantages that a rigid printed circuit board does not have:

1. It can be bent, wound, and folded freely, and can be arbitrarily arranged according to the space layout requirements, and can be moved and stretched in three-dimensional space, so as to achieve the integration of component assembly and wire connection, and high flexibility.

2. In the assembly and connection of components, the conductor cross-section of the FPC board is thin and flat compared with the use of conductive cables, which reduces the size of the conductors and can be formed along the casing, making the structure of the equipment more compact and reasonable, and not only can reduce the size of the electronics The volume of the product has also reduced a lot of weight to meet the needs of the development of electronic products in the direction of high density, miniaturization and high reliability.

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3. Use the FPC soft board to install the connection, which eliminates the error when wiring with wires and cables. As long as the processing drawings are proofread and passed, all the winding circuits produced later will be the same. There will be no wrong connection when installing the connecting line, and the consistency of the installation and connection is guaranteed.

4. When the FPC soft board is installed and connected, because it can be wired on the three planes of X, Y, and Z, the switching interconnection is reduced, the reliability of the entire system is increased, and the inspection of the fault is provided convenient.

5. According to the requirements of use, when designing the FPC soft board, the parameters such as capacitance, inductance, characteristic impedance, delay and attenuation can be controlled, and it can be designed to have the characteristics of a transmission line, and the electrical parameters are highly controllable.

FPC flexible circuit boards have the advantages of good flexibility, heat dissipation, solderability, easy assembly, high wiring density, and low overall cost. The design of soft and hard combination also compensates for the flexibility of the flexible substrate to a certain extent. The slight insufficiency of component load-bearing capacity makes its application range wider and wider.

SMT patch processing double-sided group method

SMC/SMD and T.HC can be mixed and distributed on the same side of the PCB. At the same time, SMC/SMD can also be distributed on both sides of the PCB. Double-sided hybrid assembly adopts double-sided PCB, double wave soldering or reflow soldering. In this type of assembly method, there is also a difference between SMC/SMD or SMC/SMD. Generally, it is reasonable to choose according to the type of SMC/SMD and the size of the PCB. Usually, the first-sticking method is more adopted. Two assembly methods are commonly used in this type of assembly:

(1) SMC/SMD and FHC on the same side, SMC/SMD and THC are on the same side of the PCB.

(2) SMC/SMD and iFHC have different side methods, put the surface mount integrated chip (SMIC) and THC on the A side of the PCB, and put the SMC and the small outline transistor (SOT) on the B side.

This type of patch processing and assembly method has a high assembly density due to the mounting of SMC/SMD on one or both sides of the PCB and the insertion and assembly of leaded components that are difficult to surface assembly.

The assembly method and process flow of SMT chip processing mainly depend on the type of surface mount component (SMA), the types of components used and the conditions of assembly equipment. In general, SMA can be divided into three types of single-sided mixed assembly, double-sided mixed assembly and full-surface assembly, a total of 6 assembly methods. Different types of SMA have different assembly methods, and the same type of SMA can also have different assembly methods.