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Structure and characteristics of SDM/SMC devices and FPC
Structure and characteristics of SDM/SMC devices and FPC

Structure and characteristics of SDM/SMC devices and FPC


Electronic products, especially smart (smartphones, tablet PCs) products, the fashion trend requires "exclusive and intelligent design" that is exquisite and lightweight in appearance, reliable in performance, diversified and intelligent in functions, such as the smart phones we use now. , Tablet PCs, Bluetooth headsets and other intelligent electronic products. The successful application of SMD/SMC devices on FPC has realized the development of "light" and "thin" electronic products, which has brought about the promotion of the intelligent era. For example, mobile phone products are getting thinner and thinner, and their internal structural space is getting less and less. Traditional PCB and large-pitch and larger electronic component packaging will become obstacles to lighter and thinner. Therefore, FPC and SMD/SMC devices are similar. The combination fully demonstrates its advantages. In order to improve the quality and product yield of the combined assembly of FPC and SMD/SMC devices, we must first have a clear understanding of their respective characteristics and structures.

pcb board

1. The basic structure and application characteristics of FPC.

FPC, or Flexible Printed Circuit (Flexible Printed Circuit), commonly known as soft board, is made of PET polyester film or PI polyimide film (Polyimide), which is a flexible and high temperature resistant insulating material. It is manufactured by high-pressure pressing and drilling, copper plating, exposure, development, etching pressing, punching and other complicated processes. FPC is mainly composed of 4 parts: copper foil, cover film, reinforcing plate (FR4, steel sheet, PI) adhesive film (high temperature adhesive paper, general adhesive paper).

Compared with traditional PCB, FPC has the following advantages:

1.1 Save the structural space of the product.

1.2 Save product assembly. The man-hours of the assembly process, the reduction of the volume, the reduction of the weight of the product, and the reduction of the thickness of the product, make the product compact and improve the overall yield of the product.

1.3. Enhancing the development space of electronic products. FPC can be freely bent, rolled and folded, and can be freely designed according to the structural space of electronic products, so as to achieve the close integration of SMD/SMC devices and FPC, thereby breaking the traditional concept of interconnection technology and enhancing the development space of electronic products.

2. Packaging characteristics and applications of SMD/SMC devices.

2.1. The development of SMD/SMC devices.

2.1.1 The development direction of SMD/SMC devices. SMC/SMD devices are developing in the direction of micro-miniature, ultra-thin, high-frequency, multi-function, high integration and diversification.

2.1.2. Development of integrated circuit packaging technology.

2.2. The combination of SMT and IC, SMT and high-density packaging technology promotes the development of packaging technology in a modular and systematic direction. The structural space requirements are getting smaller and smaller, so FPC plays a key role in it. For example, the current flexible packaging substrates play an important role in the development of three-dimensional packaging technology.

2.3. The welding end structure of SMD/SMC. For details, please refer to Chapter 3 Surface Mount Components (SMD/SMC) in "Surface Mount Technology (SMT) Fundamentals and Design for Manufacturability (DFM)"