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Share the advantages of SMT chip processing technology
Share the advantages of SMT chip processing technology

Share the advantages of SMT chip processing technology


With the continuous progress and development of the electronics industry, SMT surface assembly technology has become more mature, and equipment functions are constantly improving. SMT patch processing technology has gradually replaced traditional cartridge technology and has become the most popular process technology in the electronics assembly industry. "Smaller, lighter, denser, and better" are the biggest advantages of SMT chip processing technology, and it is also the current requirement for high integration and miniaturization of electronic products.

SMT chip processing flow: first apply solder paste on the surface of the printed circuit board pad, then accurately place the metalized terminals or pins of the component on the solder paste of the pad, and then connect the printed circuit board to the component Put them into a reflow oven and heat the whole to the melting of the solder paste. After cooling and solidification of the solder paste, the mechanical and electrical connections between the components and the printed circuit are realized. As a professional SMT chip processing factory, Lingxinte can provide users with various SMT services such as SMT processing fast proofing, difficult SMT chip processing, and special SMT chip processing. Let’s take a look at the advantages of SMT chip processing technology:

pcb board

1. Electronic products are small in size and high in assembly density

The volume of SMT chip components is only about 1/10 of the traditional plug-in components, and the weight is only 10% of the traditional plug-in components. Usually, the use of SMT technology can reduce the volume of electronic products by 40%~60% and the quality by 60%~80 %, the occupied area and weight are greatly reduced. The SMT patch processing assembly component grid has developed from 1.27MM to the current 0.63MM grid, and individual grids have reached 0.5MM. The through-hole mounting technology is used to install the components, which can make the assembly density higher.

2. High reliability, strong anti-vibration ability

SMT chip processing uses chip components with high reliability. The components are small and light, so it has strong anti-vibration ability. It adopts automated production and has high mounting reliability. Generally, the rate of bad solder joints is less than 10 parts per million. The wave soldering technology of through-hole plug-in components is one order of magnitude lower, which can ensure a low defect rate of solder joints of electronic products or components. At present, almost 90% of electronic products adopt SMT technology.

3. Good high frequency characteristics and reliable performance

Because the chip components are firmly mounted, the devices are usually leadless or short leads, which reduces the influence of parasitic inductance and parasitic capacitance, improves the high-frequency characteristics of the circuit, and reduces electromagnetic and radio frequency interference. The maximum frequency of the circuit designed with SMC and SMD is 3GHz, while the chip component is only 500MHz, which can shorten the transmission delay time. It can be used in circuits with a clock frequency above 16MHz. If the MCM technology is used, the high-end clock frequency of the computer workstation can reach 100MHz, and the additional power consumption caused by parasitic reactance can be reduced by 2-3 times.

4. Improve productivity and realize automated production

At present, if the perforated printed board is to be fully automated, it is necessary to expand the area of the original printed board by 40%, so that the insertion head of the automatic plug-in can insert the components, otherwise there is not enough space and the parts will be damaged. The automatic placement machine (SM421/SM411) uses a vacuum nozzle to pick and place the components. The vacuum nozzle is smaller than the shape of the component, which increases the mounting density. In fact, small components and fine-pitch QFP devices are produced using automatic placement machines to achieve full-line automated production.

5. Reduce costs and reduce expenses

(1) The use area of the printed board is reduced, the area is 1/12 of the through-hole technology, if the CSP is used for installation, its area will be greatly reduced;

(2) The number of drilling holes on the printed circuit board is reduced, saving repair costs;

(3) Due to the improvement of frequency characteristics, the circuit debugging cost is reduced;

(4) Due to the small size and light weight of chip components, the packaging, transportation and storage costs are reduced;

The use of SMT chip processing technology can save materials, energy, equipment, manpower, time, etc., and can reduce costs by 30% to 50%.